Hon Lau from San Francisco, CA

Resumes

Technical Consultant/Research Developer At Sap America

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Position:

Technical Consultant/Research Developer at SAP America, Technical Consultant at SAP America

Location:

San Francisco Bay Area

Industry:

Computer Software

Work:

SAP America since 2007
Technical Consultant/Research Developer
SAP America since 2006
Technical Consultant
Convergys, Employee Care 2008 - 2008
Consultant
Mylan Laboratories Inc 2005 - 2007
SAP Security Analyst
Computer Associate 2002 - 2004
Software Engineer

Education:

West Virginia University 2005 - 2006
MS, Computer Science Carnegie Mellon University 2004 - 2006
MS, Software Engineering University of California, Berkeley 1997 - 2001
BS, EECS/NE

Skills:

Experienced consultant specialized in SAP (R/3 ECC 6
Portal NW2004s and BI 7
0) Security Architecture and Java EE5 Technologies
Experience in enterprise software development
project management and leadership
OO analysis & design
Web Service on Java EE5 Technologies
Excellent with coordinating
mentoring and exchanging information with colleagues Always committed to team success Capable of assuming responsibility
exercising and working independently as required

Interests:

To have as much fun as possible

Actuarial Student

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Location:

San Francisco Bay Area

Industry:

Insurance

Name / Title

Company / Classification

Phones & Addresses

Hon Wing Lau

OMEGA DIGITAL LLC

Us Patents

Apparatus Having Thermal-Enhanced And Cost-Effective 3D Ic Integration Structure With Through Silicon Via Interposers
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US Patent:

8604603, Dec 10, 2013
Filed:

Feb 19, 2010
Appl. No.:

12/709291
Inventors:

Hon Shing Lau - Palo Alto CA, US
Shi-Wei Lee - Hong Kong, CN
Matthew Ming Fai Yuen - Hong Kong, CN
Jingshen Wu - Hong Kong, CN
Chi Chuen Lo - Hong Kong, CN
Haibo Fan - Hong Kong, CN
Haibin Chen - Hong Kong, CN
Assignee:

The Hong Kong University of Science and Technology - Hong Kong
International Classification:

H01L 29/72
US Classification:

257693, 257686, 257698, 257713, 257E2308, 257E2369, 257E21506, 438122, 439330
Abstract:

An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Installing Communication Protocol In A Handheld Device
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US Patent:

20030140129, Jul 24, 2003
Filed:

Jan 24, 2002
Appl. No.:

10/058494
Inventors:

Noam Livnat - Menlo Park CA, US
Hon Lau - Berkeley CA, US
International Classification:

G06F015/177
US Classification:

709/221000, 709/228000
Abstract:

Methods and system for delivering a communication protocol to a handheld electronic device. The techniques include physically attaching a first device having a first communication protocol to a second device having a plurality of communication protocols, the plurality including the first communication protocol and a second communication protocol, determining that the second communication protocol is not installed on the second device, based on this determination, selecting the first communication protocol from the plurality of communication protocols, and establishing communication between the first and second devices using the first communication protocol, transferring the second communication protocol from the second device to the first device, installing the second communication protocol on the first device, and switching to the second communication protocol for further communication. In one embodiment, the communication protocols are software-based and the electronic devices are hand-held devices such as PDAs, cell phones, and digital cameras.

Apparatus Having An Embedded 3D Hybrid Integration For Optoelectronic Interconnects
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US Patent:

20100215314, Aug 26, 2010
Filed:

Feb 19, 2010
Appl. No.:

12/709279
Inventors:

Hon Shing Lau - Palo Alto CA, US
Shi-Wei Lee - Hong Kong, CN
Matthew Ming Fai Yuen - Hong Kong, CN
Jingshen Wu - Hong Kong, CN
Chi Chuen Lo - Hong Kong, CN
Haibo Fan - Hong Kong, CN
Haibin Chen - Hong Kong, CN
Assignee:

The Hong Kong University of Science and Technology - Hong Kong
International Classification:

G02B 6/12
G02B 6/42
US Classification:

385 14, 385 47
Abstract:

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.