Howard J Holyoak

US Patent:

6387733, May 14, 2002

Filed:

May 22, 2001

Appl. No.:

09/862872

Inventors:

Howard Joseph Holyoak - High Point NC
John Cody Bailey - Mebane NC

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H01L 2144

US Classification:

438123, 257684

Abstract:

The present invention controls attachment of a first semiconductor material, such as a semiconductor die, to a second semiconductor material, such as a bond pad, substrate, or the like. A placement tool is used to pick up the first semiconductor material and move it to a defined position above the top surface of the second semiconductor material. The second semiconductor material will have an adhesive, such as epoxy, applied to its top surface. From the defined position above the second semiconductor material, the placement tool is allowed to fall for an amount of time previously determined to result in an adhesive layer of a defined thickness, within precise tolerances. The adhesive thickness is often referred to as bond line thickness (BLT) when bonding a semiconductor die to a bond pad, substrate, or the like.

US Patent:

20210398914, Dec 23, 2021

Filed:

Sep 7, 2021

Appl. No.:

17/467598

Inventors:

- Greensboro NC, US
Howard Joseph Holyoak - High Point NC, US

International Classification:

H01L 23/552
H01L 23/532
H01L 21/78
H01L 21/56
H01L 23/16
H01L 23/31

Abstract:

The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure. The perimeter bond pads are surrounding the at least one electronic component and encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound, such that a top tip of each perimeter vertical shield contact is exposed at a top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.

US Patent:

20190371740, Dec 5, 2019

Filed:

Aug 19, 2019

Appl. No.:

16/544145

Inventors:

- Greensboro NC, US
Howard Joseph Holyoak - High Point NC, US

International Classification:

H01L 23/552
H01L 23/532
H01L 21/78

Abstract:

The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure. The perimeter bond pads are surrounding the at least one electronic component and encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound, such that a top tip of each perimeter vertical shield contact is exposed at a top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.

US Patent:

20180240759, Aug 23, 2018

Filed:

Feb 23, 2018

Appl. No.:

15/903243

Inventors:

- Greensboro NC, US
Howard Joseph Holyoak - High Point NC, US

International Classification:

H01L 23/552
H01L 23/532
H01L 21/78

Abstract:

The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure. The perimeter bond pads are surrounding the at least one electronic component and encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound, such that a top tip of each perimeter vertical shield contact is exposed at a top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.

US Patent:

20150201515, Jul 16, 2015

Filed:

Jan 13, 2015

Appl. No.:

14/595615

Inventors:

- Greensboro NC, US
Jungwoo Lee - Greensboro NC, US
John August Orlowski - Summerfield NC, US
Howard Joseph Holyoak - High Point NC, US

International Classification:

H05K 7/06
H05K 13/00
H05K 1/09

Abstract:

An electronics module includes a non-conductive body, a first set of conductive features exposed on a surface of the non-conductive body, and a second set of conductive features exposed on the surface of the non-conductive body. The first set of conductive features is configured to connect to a wire bond component. The second set of conductive features is configured to connect to a flip chip component. A protective finish is provided over each one of the first set of conductive features and the second set of conductive features. The protective finish includes a layer of nickel less than 1 μm thick, a layer of palladium over the layer of nickel, and a layer of gold over the layer of palladium.