Hsiang J Chu
age ~62
from Cupertino, CA
- Also known as:
-
- Hsiang C Hu
- Hsiang Hsiang
- John Chu Hsiang
- Phone and address:
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10309 Glencoe Dr, Cupertino, CA 95014
4083941759
Hsiang Chu Phones & Addresses
- 10309 Glencoe Dr, Cupertino, CA 95014 • 4083941759
- San Jose, CA
- Renton, WA
- Santa Clara, CA
- 10309 Glencoe Dr, Cupertino, CA 95014
Work
-
Position:Clerical/White Collar
Education
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Degree:High school graduate or higher
Resumes
Instructional Designer
view sourceLocation:
Union City, CA
Industry:
E-Learning
Work:
Cisco
Instructional Designer
Varian Medical Systems Sep 2006 - Oct 2012
Elearning Instructional Developer
Custom Performance Solutions Oct 2002 - Jan 2003
Instructional Developer
Broadvision Jun 2000 - Sep 2001
Curriculum Developer
Oracle Oct 1996 - May 2000
Media Training Project Manager
Instructional Designer
Varian Medical Systems Sep 2006 - Oct 2012
Elearning Instructional Developer
Custom Performance Solutions Oct 2002 - Jan 2003
Instructional Developer
Broadvision Jun 2000 - Sep 2001
Curriculum Developer
Oracle Oct 1996 - May 2000
Media Training Project Manager
Education:
Syracuse University 1987 - 1989
Masters
Masters
Skills:
Microsoft Office
Management
Project Management
Elearning Development
Instructional Design
Team Collaboration
Audio/Video Editing
Information Mapping
Management
Project Management
Elearning Development
Instructional Design
Team Collaboration
Audio/Video Editing
Information Mapping
Hsiang Chu
view source
Hsiang Chu
view sourceUs Patents
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Method For Packing Lead Frames For Shipment Thereof
view source -
US Patent:54488770, Sep 12, 1995
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Filed:May 9, 1994
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Appl. No.:8/239994
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Inventors:Hsiang Chu - San Jose CA
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Assignee:National Semiconductor Corporation - Santa Clara CA
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International Classification:B65B 510
B65B 2500 -
US Classification:53471
-
Abstract:A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
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Magazine And Shipping Tray For Lead Frames
view source -
US Patent:53100557, May 10, 1994
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Filed:Mar 24, 1993
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Appl. No.:8/037516
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Inventors:Hsiang Chu - San Jose CA
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Assignee:National Semiconductor Corporation - Santa Clara CA
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International Classification:B65D 8530
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US Classification:206328
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Abstract:A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
Get Report for Hsiang J Chu from Cupertino, CA, age ~62