Auto Division Accountant at California Republic Bank - Auto Finance Division, Academic Program Committee Volunteer at Education for the Poor
Location:
Long Beach, California
Industry:
Accounting
Work:
California Republic Bank - Auto Finance Division - Irvine, California since Dec 2012
Auto Division Accountant
Education for the Poor - Long Beach, California since Jan 2008
Academic Program Committee Volunteer
Duthie Electric Service Corporation - Long Beach, California Mar 2011 - Dec 2012
Staff Accountant
Duthie Electric Service Corporation - Long Beach, California Jun 2008 - Sep 2008
Summer Intern
Education:
California State University-Fullerton 2009 - 2011
Masters, Accounting
UC Irvine 2004 - 2008
Bachelor of Arts, Sociology, Mathematics
Interests:
Strategic Planning, Playing Guitar & Piano, Photography, New Technology, Swimming, Professional Networking
Robert P. Wettermann - Inverness IL, US Hung Hoang - Romeoville IL, US
Assignee:
BEST Inc. - Rolling Meadows IL
International Classification:
B23K 31/02
US Classification:
228119, 228 41
Abstract:
A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.
Method For The Manual Placement Of Bottom Terminated Leadless Device Electronic Packages Using A Mated Stencil Pair
Robert P. Wettermann - Inverness IL, US Hung Hoang - Romeoville IL, US Raymond A. Cirimele - Chicago IL, US
Assignee:
Business Electronics Soldering Technologies, Inc. - Rolling Meadows IL
International Classification:
B23K 31/02 B23K 3/08
US Classification:
22818022, 228256, 228 57
Abstract:
The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.
Manual Method For Reballing Using A Solder Preform
Robert P. Wettermann - Inverness IL, US Hung Hoang - Romeoville IL, US
Assignee:
BEST, INC. - Rolling Meadows IL
International Classification:
B23K 31/02
US Classification:
228119
Abstract:
A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.
Dr. Hoang graduated from the Med & Pharm Univ, Ho Chi Minh City, Vietnam (942 01 Eff 1/83) in 1973. He works in Rancho Cordova, CA and 2 other locations and specializes in Family Medicine and General Practice. Dr. Hoang is affiliated with Dignity Health Mercy General Hospital, Dignity Health Sierra Nevada Memorial Hospital, Methodist Hospital Sacramento and Sutter Health Roseville Medical
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Hung Hoang
Work:
Universal Data, Inc. - Web Applications Developer (2003-2005) Academy of General Dentistry - Web Development Application Specialist (2005-2006)
Education:
Louisiana State University - Dental, University of New Orleans - MBA, Louisiana State University - Computer Science
Hung Hoang
Work:
Doan ca mua nhac hoi CUU CHIEN BINH TP.HCM - Tro ly to chuc nhan su + to chuc bieu dien (1989)
Relationship:
Married
About:
Song gian di,binh dang.ghet xu ninh + hen nhat. neu lam dc 1 viec gi ma co it cho dong bao va to quoc thi cho du co phai mat mang cung no nu cuoi vi : tich duoc 1 ti Cong Duc cho BINO be xiu cua BA
Tagline:
48tuoi,1 vo +1 be trai 8 tuoi.luon lac quan de song nhung thang ngay cuoi doi that y nghia
Bragging Rights:
+Bang khen do trung uong hoi CCB tang da
Hung Hoang
Work:
Habeco Bank of America
Education:
12/12
Bragging Rights:
La doan vien xs
Hung Hoang
Education:
Hoa Sen University - Networking
Relationship:
Single
About:
...::[S].lient [W]olf::...
Tagline:
L'amour ce n'est pas se regarder l'un l'autre, c'est regarder ensemble dans la même direction.
Hung Hoang
Work:
Hiroshima arumi (2012)
Education:
Nguyen xuan on
Hung Hoang
Education:
Thomas More College, The Pines primary school
About:
A camera phone is to photography what 2 minute noodles are to cooking.
Hung Hoang
Work:
Germantown Athletic Club - Weight Floor Attendant (2011)
Education:
University of Memphis - Health and Human Performance