Dr. Trinh graduated from the Med & Pharm Univ, Ho Chi Minh City, Vietnam (942 01 Eff 1/83) in 1967. He works in San Jose, CA and specializes in Family Medicine. Dr. Trinh is affiliated with Regional Medical Center Of San Jose.
Jan 2014 to 2000 Adviser TechBombardier Wichita, KS Feb 2011 to Dec 2013 Methods EngineerAdvent Electronic Gilbert, AZ Aug 2009 to Feb 2011 Sr. Advisory StaffBoeing Everett, WA Apr 2007 to Jun 2009 Sr. Manufacturing EngineerHoneywell Phoenix, AZ Jun 2004 to Apr 2007 Sr. Manufacturing EngineerNorment Security Group, Inc
Feb 1998 to Feb 2004 Process Engineer
Education:
THE UNIVERSITY OF ARIZONA Tucson, AZ Dec 1996 Bachelor of ScienceGLENDALE COMMUNITY COLLEGE Glendale, AZ Dec 1996 Associate of Applied Science in Engineering Technology
Name / Title
Company / Classification
Phones & Addresses
Hung Trinh
AMBIANCE NAILS 4 INC
Us Patents
Ceramic Chip Capacitor Of Conventional Volume And External Form Having Increased Capacitance From Use Of Closely Spaced Interior Conductive Planes Reliably Connecting To Positionally Tolerant Exterior Pads Through Multiple Redundant Vias
Daniel Devoe - San Diego CA 92107 Alan Devoe - La Jolla CA 92037 Lambert Devoe - San Diego CA 92122 Hung Trinh - San Diego CA 92131
International Classification:
H01G 406
US Classification:
3613212, 3613061, 3613063, 361313, 361311
Abstract:
A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.
Fringe-Field Non-Overlapping-Electrodes Discoidal Feed-Through Ceramic Filter Capacitor With High Breakdown Voltage
Hung Trinh - San Diego CA Daniel F. Devoe - San Diego CA
Assignee:
Presidio Components, Inc. - San Diego CA
International Classification:
H01G 435
US Classification:
361302, 361303
Abstract:
The size and placement of internal metallization areas as do collectively form each of two electrodes is improved in a typically discoidal feed-through ceramic filter capacitor having (i) multiple ceramic layers, (ii) a hole passing a wire that carries electrical signals which are to be filtered, (iii) metal lining the hole so as to make electrical contact with the wire, and (iv) an exterior metal band connected to ground. First internal metallization areas, each in the shape of a relatively smaller small-aperture disk, are centered about the bodys hole in contact with the metal lining, each area being upon one of the bodys multiple ceramic layers, the areas collectively serving as a first electrode of the capacitor. Second internal metallization areas, each in the shape of a relatively larger large-apertured disk also centered about the hole and upon one of the ceramic layers, make at their exterior edge surface electrical contact with the metal band, thereby to serve as a second electrode of the capacitor. The respective metallization areas of each electrode are both (i) spaced far apart by previous standards, and, preferably, (ii) are located upon alternating ceramic layers, making that any voltage breakdown path is necessarily both (i) long and with (ii) both radial and longitudinal components.
Feed-Through Filter Capacitor With Non-Overlapping Electrodes
Hung Trinh - San Diego CA Daniel F. Devoe - San Diego CA
Assignee:
Presidio Components, Inc. - San Diego CA
International Classification:
H01G 435
US Classification:
304302, 361303
Abstract:
A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes. Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes. The filtering and coupling are electrically connected in series.
Alan Devoe - La Jolla CA Lambert Devoe - San Diego CA Hung Trinh - San Diego CA
Assignee:
Presidio Components, Inc. - San Diego CA
International Classification:
H01G 4005
US Classification:
361303, 3613061, 361311
Abstract:
A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, the coated composite is mounted, and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.
Ceramic Chip Capacitor Of Conventional Volume And External Form Having Increased Capacitance From Use Of Closely Spaced Interior Conductive Planes Reliably Connecting To Positionally Tolerant Exterior Pads Through Multiple Redundant Vias
A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.
Ceramic Chip Capacitor Of Conventional Volume And External Form Having Increased Capacitance From Use Of Closely Spaced Interior Conductive Planes Reliably Connecting To Positionally Tolerant Exterior Pads Through Multiple Redundant Vias
A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.
Alan Devoe - La Jolla CA Lambert Devoe - San Diego CA Hung Trinh - San Diego CA
Assignee:
Presidio Components, Inc. - San Diego CA
International Classification:
H01G 4005
US Classification:
361303, 3613061, 361311
Abstract:
A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.
Alan Devoe - La Jolla CA, US Lambert Devoe - San Diego CA, US Hung Trinh - San Diego CA, US
Assignee:
Presidio Components, Inc. - San Diego CA
International Classification:
H01G004/005 H01G004/228 H01G004/06
US Classification:
361303, 3613061, 361311
Abstract:
A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal composite material are laminated together, diced into individual chips, and fired to sinter the glass and the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the printed circuit board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.
License Records
Hung Vy Trinh
License #:
1200014145
Category:
Cosmetologist Temporary Permit
Googleplus
Hung Trinh
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Hung Trinh
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Hung Trinh
Work:
Pilot - Vietnam Airlines (2010)
Education:
Hanoi University of Technology - Bachelor of Engineer