Ingrid B Peterson

US Patent:

7418124, Aug 26, 2008

Filed:

Jul 15, 2003

Appl. No.:

10/619943

Inventors:

Ingrid B. Peterson - Menlo Park CA, US
Mike Von den Hoff - Munich, DE
Jim Wiley - Menlo Park CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G06K 9/00
H04N 7/18
G02B 21/06
G06F 17/50

US Classification:

382144, 348131, 359385, 703 13

Abstract:

Methods that include acquiring aerial images of a reticle for different values of a member of a set of lithographic variables are provided. One method also includes determining a presence of an anomaly in a design pattern of the reticle by comparing at least one pair of the aerial images corresponding to at least two of the different values. A different method includes comparing at least one pair of the aerial images corresponding to at least two of the different values and determining an area on the reticle where a lithography process using the reticle is most susceptible to failure based on the results of the comparison. Another embodiment includes determining a presence of transient repeating defects on the reticle by subtracting non-transient defects from the aerial images and comparing at least one pair of the aerial images corresponding to at least two of the different values.

US Patent:

7729529, Jun 1, 2010

Filed:

Dec 7, 2004

Appl. No.:

11/005658

Inventors:

Kenong Wu - Davis CA, US
David Randall - Sunnyvale CA, US
Kourosh Nafisi - Los Altos CA, US
Ramon Ynzunza - Milpitas CA, US
Ingrid B. Peterson - Menlo Park CA, US
Ariel Tribble - Fremont CA, US
Michal Kowalski - Santa Cruz CA, US
Lisheng Gao - Morgan Hill CA, US
Ashok Kulkarni - San Jose CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G06K 9/00
H01L 21/66
G06F 17/50

US Classification:

382149, 382144, 382145, 382147, 382148, 438 15, 716 1, 716 21

Abstract:

Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

US Patent:

7769225, Aug 3, 2010

Filed:

Dec 20, 2005

Appl. No.:

11/314813

Inventors:

Sagar A. Kekare - Plano TX, US
Ingrid B. Peterson - Menlo Park CA, US
Moshe E. Preil - Sunnyvale CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G06K 9/00
G01N 21/00
G01B 5/28

US Classification:

382145, 382144, 382146, 382147, 382148, 382149, 3562374, 3562375, 3562376, 702 35

Abstract:

Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.

US Patent:

8078304, Dec 13, 2011

Filed:

Jul 20, 2008

Appl. No.:

12/176381

Inventors:

Michael R. Rice - Pleasanton CA, US
Jeffrey C. Hudgens - San Francisco CA, US
Todd J. Egan - Fremont CA, US
Ingrid B. Peterson - Menlo Park CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G06F 19/00

US Classification:

700112, 700245, 41422208, 414935

Abstract:

Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e. g. , a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e. g. , between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e. g. , metrology).

US Patent:

8111900, Feb 7, 2012

Filed:

May 15, 2010

Appl. No.:

12/780864

Inventors:

Kenong Wu - Davis CA, US
David Randall - Sunnyvale CA, US
Kourosh Nafisi - Los Altos CA, US
Ramon Ynzunza - Milpitas CA, US
Ingrid B. Peterson - Menlo Park CA, US
Ariel Tribble - Fremont CA, US
Michal Kowalski - Santa Cruz CA, US
Lisheng Gao - Morgan Hill CA, US
Ashok Kulkarni - San Jose CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G06K 9/00
G01R 31/26
G21K 5/00
G06F 17/50

US Classification:

382144, 382145, 382147, 382148, 382149, 438 15, 378 34, 716 55

Abstract:

Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

US Patent:

8213704, Jul 3, 2012

Filed:

May 7, 2008

Appl. No.:

12/116664

Inventors:

Ingrid B. Peterson - Menlo Park CA, US
Ed Yum - Fremont CA, US

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

G06K 9/00
G01N 21/00

US Classification:

382145, 382144, 382149, 382170, 3562374, 3562375

Abstract:

Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.

US Patent:

20040009416, Jan 15, 2004

Filed:

Aug 2, 2002

Appl. No.:

10/211156

Inventors:

Ingrid Peterson - Menlo Park CA, US
Mike Hoff - Muenchen, DE

International Classification:

G03F007/207
G03F007/23
G03F009/02

US Classification:

430/030000, 430/311000, 430/394000

Abstract:

The invention is a method of determining the presence of an anomaly in qualifying a pattern, patterning process, or patterning apparatus used in the fabrication of microlithographic patterns. A preferred implementation of the method qualifies incoming reticles and process conditions on test wafers to maximize the available usable process window for a given reticle exposure tool combination. Practicing this method on test wafers enables the identification of spatial areas where a process will fail first and candidate regions for carrying out defect inspection and metrology. Other preferred implementations of the method qualify masks, reticles, or other patterns characterized by data bases on which are stored image data acquired by practice of aerial image measurement system (AIMS) or design rule checking (DRC) techniques.

US Patent:

20090130821, May 21, 2009

Filed:

Oct 10, 2008

Appl. No.:

12/249812

Inventors:

Damon K. Cox - Round Rock TX, US
Todd J. Egan - Fremont CA, US
Michael X. Yang - Palo Alto CA, US
Jeffrey C. Hudgens - San Francisco CA, US
Ingrid B. Peterson - Menlo Park CA, US
Michael R. Rice - Pleasanton CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/30
G06F 17/50

US Classification:

438455, 716 2, 156538, 1563798, 257E21598

Abstract:

A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques.