Jack L Boyd

US Patent:

6391436, May 21, 2002

Filed:

May 20, 1999

Appl. No.:

09/315064

Inventors:

Guo Feng Xu - Irvine CA
Linas Repecka - Lakewood CA
Steve Mortimer - Flintshire, GB
Steve Peake - Forest Hill MD
Jack Boyd - Phoenix AZ

Assignee:

Cytec Technology Corp. - Wilmington DE

International Classification:

B32B 2704

US Classification:

4282981, 4282974, 4282987, 4282991, 4282997, 4282951, 4282934

Abstract:

The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg in a vacuum envelope, said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.

US Patent:

8080313, Dec 20, 2011

Filed:

May 25, 2010

Appl. No.:

12/787180

Inventors:

Mark Richard Bonneau - Brea CA, US
Jack Douglas Boyd - Silverado CA, US
Gordon T. Emmerson - Los Alamitos CA, US
Scott D. Lucas - Anaheim Hills CA, US
Stephen J. Howard - Chino CA, US
Spencer Donald Jacobs - Corona CA, US

Assignee:

Cytec Technology Corp. - Wilmington DE

International Classification:

B32B 27/04

US Classification:

4282974, 4282921

Abstract:

Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature. It is further discovered that the relative placement of the toughening particles influences composite mechanical properties, such as compression after impact (CAI) strength.

US Patent:

8268926, Sep 18, 2012

Filed:

May 25, 2010

Appl. No.:

12/787201

Inventors:

Mark Richard Bonneau - Brea CA, US
Jack Douglas Boyd - Silverado CA, US
Gordon T. Emmerson - Los Alamitos CA, US
Scott D. Lucas - Anaheim Hills CA, US
Stephen J. Howard - Chino CA, US
Spencer Donald Jacobs - Corona CA, US

Assignee:

Cytec Technology Corp. - Wilmington DE

International Classification:

C08K 5/13
C08L 61/02
C08L 63/02
C08L 71/12
C08L 79/08
C08L 81/06
C08L 83/10

US Classification:

524588, 523456, 525393, 525421, 525423, 525431, 525471, 525474, 525476, 525479

Abstract:

Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.

US Patent:

8313830, Nov 20, 2012

Filed:

Nov 8, 2011

Appl. No.:

13/291906

Inventors:

Mark Richard Bonneau - Brea CA, US
Jack Douglas Boyd - Silverado CA, US
Gordon T. Emmerson - Los Alamitos CA, US
Scott D. Lucas - Anaheim Hills CA, US
Stephen Jacob Howard - Chino CA, US
Spencer Donald Jacobs - Corona CA, US

Assignee:

Cytec Technology Corp. - Wilmington DE

International Classification:

D04H 1/00

US Classification:

4282921, 4282974

Abstract:

Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature. It is further discovered that the relative placement of the toughening particles influences composite mechanical properties, such as compression after impact (CAI) strength.

US Patent:

8389631, Mar 5, 2013

Filed:

Dec 17, 2008

Appl. No.:

12/336997

Inventors:

Christopher Bongiovanni - Long Beach CA, US
Jack Boyd - Silverado CA, US
Christopher Pederson - Orange CA, US

Assignee:

Cytec Technology Corp. - Wilmington DE

International Classification:

C08L 71/10

US Classification:

525132, 526262, 526333, 526334, 528322

Abstract:

The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.

US Patent:

20100098906, Apr 22, 2010

Filed:

Oct 16, 2009

Appl. No.:

12/581053

Inventors:

Christopher Lee Bongiovanni - Anaheim CA, US
Jack Douglas Boyd - Silverado CA, US

International Classification:

B32B 3/26
B32B 3/10
B32B 5/02
B29C 65/00
B29C 67/20
B32B 27/04
B32B 38/04

US Classification:

428138, 428156, 156286, 264284, 428137, 264413

Abstract:

Systems and methods for the fabrication of prepregs possessing enhanced ability for the removal of gases from within prepregs and prepreg layups prior to and/or during at least a portion of consolidation and cure process to form composite structures are disclosed. In certain embodiments, perforations of selected configurations may be introduced into the prepregs prior to, during, and after layup. The perforations provide routes for gases trapped within and between the perforated prepregs and prepreg lay-ups to escape during consolidation and cure process, reducing the residual porosity within the resulting composite. For example, composites having residual porosities less than 10 vol. %, on the basis of the volume of the composite, may be achieved in this manner.

US Patent:

20100222461, Sep 2, 2010

Filed:

Feb 24, 2010

Appl. No.:

12/711351

Inventors:

Christopher Lee Bongiovanni - Anaheim CA, US
Jack Douglas Boyd - Silverado CA, US

Assignee:

CYTEC TECHNOLOGY CORP. - Wilmington DE

International Classification:

C08G 59/14
C08L 63/00
C08L 77/00
C08L 1/00

US Classification:

524 35, 525523, 525533, 525423, 525449, 525187, 525471

Abstract:

Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone. Furthermore, this elevated degree of curing of the polymer composition may be achieved with substantially no reduction in tack life and/or out life of the prepreg, adhesive or film or cured state mechanical properties of composites, adhesives or other products fabricated therefrom, such as open hole compression strength and compressive strength after impact. The glass transition temperature of the cured polymer compositions is similarly unaffected.

US Patent:

52427480, Sep 7, 1993

Filed:

Jan 4, 1989

Appl. No.:

7/293236

Inventors:

Thomas Folda - Neuleiningen, DE
Jack D. Boyd - Westminster CA
Helmut Tesch - Birkenheide, DE
Thomas Weber - Ludwigshafen, DE
Hans G. Recker - Irvine CA

Assignee:

BASF Aktiengesellschaft - Ludwigshafen

International Classification:

C08L 6300
C08F28304
B32B 2700

US Classification:

428272

Abstract:

The incorporation of 2 to 25. mu. m particles of a limited class of polyimides having appreciable nonaromatic character into heat curable epoxy resin systems significantly increases the toughness of such systems without loss of other desirable properties. These toughened epoxy resin systems are useful in preparing carbon fiber reinforced composites having compression strength after impact (CAI) of greater than 45 Ksi after a 1500 in-lb/in impact.