James T Clements

US Patent:

46674012, May 26, 1987

Filed:

Nov 26, 1985

Appl. No.:

6/801745

Inventors:

James R. Clements - West Bloomfield MI
Terry T. J. Yu - Mt. Clemens MI
Laura H. C. Yu - Mt. Clemens MI

International Classification:

H05K 330

US Classification:

29832

Abstract:

An electronic device made by the method of connecting a circuit member (18) to a substrate (12) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning conductive terminals (20) of the circuit member (18) over preselected ones of conductive paths (16) of the substrate (12). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically between the conductive terminal (20) and conductive bath (16).

US Patent:

47207400, Jan 19, 1988

Filed:

Dec 19, 1986

Appl. No.:

6/943509

Inventors:

James R. Clements - West Bloomfield MI
Terry T. J. Yu - Mt. Clemens MI
Laura H. C. Yu - Mt. Clemens MI

International Classification:

H01L 2328

US Classification:

357 72

Abstract:

An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically aligned between the conductive terminal (20) and conductive path (16) while the resin unconcentrated adhesive (22) remains nonconductive between laterally spaced terminals (20) and conductive paths (16).

US Patent:

52585778, Nov 2, 1993

Filed:

Nov 22, 1991

Appl. No.:

7/796453

Inventors:

James R. Clements - West Bloomfield MI

International Classification:

H01L 2700
H05K 100
H05K 300

US Classification:

174 88R

Abstract:

An electronic device is made by a method of connecting a circuit member to a substrate. The circuit member is of the type having a discontinuous passivating layer thereon with recesses therein establishing electrical contacts. The circuit member is connected to a mounting surface of a substrate having conductive paths. An adhesive including a resin with spaced conductive metal particles suspended therein is applied over the conductive paths. The distance between the electrical contacts and conductive paths is decreased to provide electrical conduction through the adhesive, while maintaining the adhesive between conductive paths non-conductive. The conductive paths may have established thereon raised or protruding contact surfaces over a portion thereof. The circuit member is mounted on the adhesive while vertically aligning the electrical contacts over pre-selected protruding contact surfaces. Pressure is applied to concentrate the conductive metal particles between the electrical contacts and conductive paths allowing conduction therethrough.

US Patent:

48686379, Sep 19, 1989

Filed:

Oct 5, 1987

Appl. No.:

7/105999

Inventors:

James R. Clements - West Bloomfield MI
Terry T. J. Yu - Mt. Clemens MI
Laura H. C. Yu - Mt. Clemens MI

International Classification:

H01L 2328

US Classification:

357 72

Abstract:

An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16). The percent by weight content of the conductive metal particles in the adhesive (22) is concentrated between each conductive terminal (20) and the vertically aligned conductive paths (16) to between forty to fifty percent by weight to decrease the spacing between the metal particles allowing conductivity through the resin and making the resin uniaxially conductive vertically aligned between the conductive terminal (20) and conductive path (16) while the resin unconcentrated adhesive (22) remains nonconductive between laterally spaced terminals (20) and conductive paths (16).