James Martin Engel

US Patent:

7983387, Jul 19, 2011

Filed:

Oct 20, 2009

Appl. No.:

12/582359

Inventors:

Chin Hoi Toh - Orange CA, US
Rodney Stephen Wright - Huntington Beach CA, US
James E. Engel - Newport Beach CA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

G01N 23/04
G01N 23/201
G01B 15/02

US Classification:

378 57, 378 86, 378 89

Abstract:

The different advantageous embodiments provide a system for identifying a likelihood of detecting objects with a backscatter x-ray system comprising a structure having a number of objects, a plurality of databases, and a processor unit configured to execute a detection analysis process. The processor unit executes the detection analysis process to identify the number of objects, identify a number of densities associated with each of the number of objects, determine a likelihood of detecting each of the number of objects with the backscatter x-ray system, and generate a three-dimensional diagram of the likelihood of detecting each of the number of objects.

US Patent:

8366848, Feb 5, 2013

Filed:

Jul 1, 2011

Appl. No.:

13/174911

Inventors:

Chin H. Toh - Orange CA, US
James E. Engel - Newport Beach CA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

B32B 41/00

US Classification:

156 64, 156 60, 156247, 156378, 156379, 156702, 378 86, 378 87

Abstract:

Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.