James K Everett

US Patent:

6432747, Aug 13, 2002

Filed:

Jul 5, 2000

Appl. No.:

09/610063

Inventors:

James L. Everett - Poway CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01L 2144

US Classification:

438118, 438106, 438107, 438119, 438121, 438125, 257684, 257690

Abstract:

An approach to repairing broken or missing leads of integrated microcircuit assemblies includes the use of a repair enhancement device ( ). The enhancement device ( ) is welded to an attachment end of a replacement lead ( ), where the enhancement device ( ) has a larger contact surface area than the attachment end of the replacement lead ( ). The enhancement device ( ) is then attached to a housing ( ) of the microcircuit assembly such that the surface area of the enhancement device ( ) provides significant mechanical reinforcement to the replacement lead. Welding the enhancement device ( ) to the replacement lead ( ) eliminates problems associated with subsequent soldering operations. An attachment region ( ) is also etched out of the housing ( ) adjacent to a conductive element ( ) of the housing, where the conductive element ( ) provides a conductive pathway through the housing to the underlying microcircuit. The enhancement device ( ) is then aligned with the attachment region ( ), and bonded to the conductive element ( ) with an electrically conductive adhesive. The etching process further improves mechanical strength.