James C Farmer

US Patent:

6390905, May 21, 2002

Filed:

Mar 31, 2000

Appl. No.:

09/540476

Inventors:

Nikolay N. Korovin - Phoenix AZ
Stephen C. Schultz - Gilbert AZ
John D. Herb - Phoenix AZ
James L. Farmer - Tempe AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 2900

US Classification:

451286, 451398, 451289

Abstract:

An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer.

US Patent:

6612903, Sep 2, 2003

Filed:

Jan 22, 2002

Appl. No.:

10/053974

Inventors:

Nikolay N. Korovin - Phoenix AZ
Stephen C. Schultz - Gilbert AZ
John D. Herb - Phoenix AZ
James L. Farmer - Tempe AZ

Assignee:

Speedfam-IPEC Corporation - Chandler AZ

International Classification:

B24B 4900

US Classification:

451 9, 451 41, 451286, 451289

Abstract:

An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer.

US Patent:

6659850, Dec 9, 2003

Filed:

Apr 11, 2002

Appl. No.:

10/120600

Inventors:

Nikolay N. Korovin - Phoenix AZ
Stephen C. Schultz - Gilbert AZ
John D. Herb - Phoenix AZ
James L. Farmer - Tempe AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 2900

US Classification:

451286, 451288, 451398, 451 41

Abstract:

An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

US Patent:

6752442, Jun 22, 2004

Filed:

Nov 9, 2001

Appl. No.:

10/040996

Inventors:

Randy McNurlin - Phoenix AZ
Mark Maggio - Phoenix AZ
Michael Smigel - Phoenix AZ
Ann Wilkey - Phoenix AZ
James L. Farmer - Tempe AZ
Shawn Robertson - Phoenix AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B66C 110

US Classification:

294106, 294 90, 414739, 414941, 901 39

Abstract:

A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus, the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position, the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

US Patent:

6979034, Dec 27, 2005

Filed:

Mar 12, 2004

Appl. No.:

10/801404

Inventors:

Randy McNurlin - Phoenix AZ, US
Mark Maggio - Phoenix AZ, US
Michael Smigel - Phoenix AZ, US
Ann Wilkey - Phoenix AZ, US
James L. Farmer - Tempe AZ, US
Shawn Robertson - Phoenix AZ, US

Assignee:

SpeedFam IPEC Corporation - Chandler AZ

International Classification:

B66C001/10
B25J015/08

US Classification:

294106, 294 90, 414739, 414941, 901 39

Abstract:

A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

US Patent:

7014541, Mar 21, 2006

Filed:

Sep 26, 2003

Appl. No.:

10/672017

Inventors:

Nikolay N. Korovin - Phoenix AZ, US
Stephen C. Schultz - Gilbert AZ, US
John D. Herb - Phoenix AZ, US
James L. Farmer - Tempe AZ, US

Assignee:

Speedfam-Ipec Corporation - Chandler AZ

International Classification:

B24B 1/00

US Classification:

451 59, 451289, 451398

Abstract:

An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

US Patent:

7025664, Apr 11, 2006

Filed:

Apr 21, 2004

Appl. No.:

10/830412

Inventors:

Nikolay N. Korovin - Phoenix AZ, US
Stephen C. Schultz - Gilbert AZ, US
John D. Herb - Phoenix AZ, US
James L. Farmer - Tempe AZ, US

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 29/00

US Classification:

451289, 451398, 451286

Abstract:

An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

US Patent:

7140956, Nov 28, 2006

Filed:

Dec 29, 2005

Appl. No.:

11/324038

Inventors:

Nikolay N. Korovin - Phoenix AZ, US
Stephen C. Schultz - Gilbert AZ, US
John D. Herb - Phoenix AZ, US
James L. Farmer - Tempe AZ, US

Assignee:

Speedfam-Ipec Corporation - Chandler AZ

International Classification:

B24B 20/00

US Classification:

451289, 451398, 451286

Abstract:

An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.