James E Fluegel
age ~71
from Longs, SC
- Also known as:
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- Jim Fluegel
- James E El
- James E Flugal
- Jmes Fluegel
- James Fleugel
- Fluegel James
James Fluegel Phones & Addresses
- Longs, SC
- 328 Cedar Heights Rd, Rhinebeck, NY 12572 • 8458765449
- Tivoli, NY
Resumes
James Fluegel
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James Fluegel
view sourceUs Patents
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Copper Seed Layer Repair Technique Using Electroless Touch-Up
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US Patent:6395164, May 28, 2002
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Filed:Oct 7, 1999
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Appl. No.:09/414224
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Inventors:Panayotis Andricacos - Croton-on-Hudson NY
James E. Fluegel - Tivoli NY
John G. Gaudiello - Poughkeepsie NY
Ronald D. Goldblatt - Yorktown Heights NY
Sandra G. Malhotra - Beacon NY
Milan Paunovic - Port Washington NY -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:C25D 712
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US Classification:205157, 205186, 205187
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Abstract:An electroless touch-up process for repairing copper metallization deposited in dual damascene structures with high aspect ratios. An initial copper strike layer is produced by directional deposition techniques such that discontinuous sidewall coverage occurs. An evolutionary electroless touch-up process then proceeds to conformally grow the copper layer on all surfaces. The result of the evolutionary process is to produce a continuous copper strike layer that can be used with conventional electroplating techniques.
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Method Of Controlling Chemical Bath Composition In A Manufacturing Environment
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US Patent:6471845, Oct 29, 2002
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Filed:Dec 15, 1999
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Appl. No.:09/461849
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Inventors:John O. Dukovic - Pleasantville NY
Erick G. Walton - Underhill VT
Peter S. Locke - Hopewell Junction NY
Panayotis C. Andricacos - Croton-on-Hudson NY
James E. Fluegel - Rhinebeck NY
Evan Patton - Portland OR
Jonathan Reid - Sherwood OR -
Assignee:International Business Machines Corporation - Armonk NY
Novellus Systems, Inc. - San Jose CA -
International Classification:C25D 2112
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US Classification:205 81, 205101, 137 93
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Abstract:A method for controlling the composition of a chemical bath in which predictive dosing is used to account for changes in the composition of the bath in which the operating characteristics of the process are partitioned into a plurality of operating modes and the consumption or generation of materials related to the process are determined empirically and additions of material are made as appropriate.
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Electroplating Apparatus With Vertical Electrical Contact
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US Patent:6627052, Sep 30, 2003
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Filed:Dec 12, 2000
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Appl. No.:09/734830
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Inventors:James Edward Fluegel - Rhinebeck NY
Peter Stevens Locke - Hopewell Junction NY
Yuet-Ying Yu - Hopewell Junction NY -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:C25D 1700
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US Classification:204224R, 204279
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Abstract:An electrodeposition apparatus for depositing material on a surface of a substrate. The electrodeposition apparatus includes at least one contact for vertically contacting the substrate and providing electrical connection to the substrate. The at least one contact does not scratch the surface of the substrate to be plated. A voltage source is connected to the at least one contact.
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Electroplated Copper Interconnection Structure, Process For Making And Electroplating Bath
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US Patent:7227265, Jun 5, 2007
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Filed:Mar 29, 2004
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Appl. No.:10/810719
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Inventors:Panayotis C. Andricacos - Croton-On-Hudson NY, US
Steven H. Boettcher - Fishkill NY, US
Dean S. Chung - Essex Junction VT, US
Hariklia Deligianni - Edgewater NJ, US
James E. Fluegel - Rhinebeck NY, US
Wilma Jean Horkans - Ossining NY, US
Keith T. Kwietniak - Highlandfalls NY, US
Peter S. Locke - Hopewell Junction NY, US
Christopher C. Parks - Poughkeepsie NY, US
Andrew H. Simon - Fishkill NY, US
Erick G. Walton - Underhill VT, US -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:H01L 23/48
H01L 23/52
H01L 29/40 -
US Classification:257762, 257751, 257752, 257753, 257E21579, 257E21584, 257E21585
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Abstract:Interconnect structures with copper conductors being at least substantially free of internal seams or voids are obtained employing an electroplating copper bath containing dissolved cupric salt wherein the concentration of the salt is at least about 0. 4 molar and up to about 0. 5 molar concentration of an acid. Also provided are copper damascene structures having an aspect ratio of greater than about 3 and a width of less than about 0. 275 μm and via openings filled with electroplated copper than is substantially free of internal seams or voids.
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Manufacturable Cowp Metal Cap Process For Copper Interconnects
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US Patent:7253106, Aug 7, 2007
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Filed:Dec 22, 2004
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Appl. No.:10/905230
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Inventors:Darryl D. Restaino - Modena NY, US
Donald F. Canaperi - Bridgewater CT, US
Judith M. Rubino - Ossining NY, US
Sean P. E. Smith - Hopewell Junction NY, US
Richard O. Henry - Wappingers Falls NY, US
James E. Fluegel - Rhinebeck NY, US
Mahadevaiyer Krishnan - Hopewell Junction NY, US -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:H01L 21/44
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US Classification:438678, 438687
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Abstract:A method to electrolessly plate a CoWP alloy on copper in a reproducible manner that is effective for a manufacturable process. In the method, a seed layer of palladium (Pd) is deposited on the copper by an aqueous seeding solution of palladium acetate, acetic acid and chloride. Thereafter, a complexing solution is applied to remove any Pd ions which are adsorbed on surfaces other than the copper. Finally, a plating solution of cobalt (Co), tungsten (W) and phosphorous (P) is applied to the copper so as to deposit a layer of CoWP on the Pd seed and copper.
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Manufacturable Cowp Metal Cap Process For Copper Interconnects
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US Patent:7407605, Aug 5, 2008
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Filed:May 22, 2007
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Appl. No.:11/751788
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Inventors:Darryl D. Restaino - Modena NY, US
Donald F. Canaperi - Bridgewater CT, US
Judith M. Rubino - Ossining NY, US
Sean P. E. Smith - Hopewell Junction NY, US
Richard O. Henry - Wappingers Falls NY, US
James E. Fluegel - Rhinebeck NY, US
Mahadevaiyer Krishnan - Hopewell Junction NY, US -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:H01B 1/00
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US Classification:2525192, 2525216, 423 22, 423491
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Abstract:An aqueous seeding solution of palladium acetate, acetic acid and chloride.
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Void-Free Damascene Copper Deposition Process And Means Of Monitoring Thereof
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US Patent:7678258, Mar 16, 2010
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Filed:Jul 10, 2003
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Appl. No.:10/615794
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Inventors:Panayotis Andricacos - Croton-on-Hudson NY, US
Dean S. Chung - Essex Junction VT, US
Hariklia Deligianni - Tenafly NJ, US
James E. Fluegel - Rhinebeck NY, US
Keith T. Kwietniak - Highlandfalls NY, US
Peter S. Locke - Hopewell Junction NY, US
Darryl D. Restaino - Modena NY, US
Philippe M. Vereecken - Sleepy Hollow NY, US
Erick G. Walton - Shelburne VT, US -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:C25D 5/00
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US Classification:205 81, 205101
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Abstract:An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating baths. More particularly, the present invention relates to the stability of copper plating baths. More particularly, the present invention relates to prevention of void formation by monitoring the accumulation of deleterious by-products in copper plating baths.
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Method Of Forming Planar Cu Interconnects Without Chemical Mechanical Polishing
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US Patent:20040094511, May 20, 2004
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Filed:Nov 20, 2002
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Appl. No.:10/300468
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Inventors:Wei-Tsu Tseng - Hopewell Junction NY, US
Darryl Restaino - Modena NY, US
James Fluegel - Rhinebeck NY, US
Richard Henry - Wappingers Falls NY, US
John Cotte - New Fairfield CT, US
Mahadevaiyer Krishnan - Hopewell NY, US
Hariklia Deligianni - Tenafly NJ, US
Philippe Vereecken - Sleepy Hollow NY, US
Stephen Greco - Lagrangeville NY, US -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:C23F001/00
B44C001/22
C03C015/00
C03C025/68 -
US Classification:216/083000
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Abstract:A method for controlling the shape of copper features, having the following steps: a) plating a copper feature with a predetermined final shape onto a copper seed layer in a plating bath for a first plating time using a first plating method, wherein the first plating time is less than the total length of time necessary to plate the substantially all of the final shape; and b) electrically treating the plated copper feature in a copper plating bath for a second period of time, the second period of time sufficient to at least form the predetermined final shape.
James Fluegel
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Ronald Korte, Marcella Aileen Kryka, Sam Phelps, Kathleen Mcgraw, Crystle Harmon
James Fluegel
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Classmates
James Fluegel
view sourceSchools:
Bishop Loughlin High School Brooklyn NY 1939-1943
Community:
Christina Talty, Eugene Buehl
Bishop Loughlin High Scho...
view sourceGraduates:
James Fluegel (1939-1943),
Andres Ara (1983-1987),
Wendell Tucker (1989-1993),
Raymond Gorman (1955-1959),
Chaquana Carr (1989-1993)
Andres Ara (1983-1987),
Wendell Tucker (1989-1993),
Raymond Gorman (1955-1959),
Chaquana Carr (1989-1993)
Googleplus
James Fluegel
Work:
ConocoPhillips - Real Time Power Trader (2007)
KPMG (2006-2007)
KPMG (2006-2007)
Education:
University of Houston - MBA, Schreiner University - BBA
Tagline:
Just trying to catch the carrot...
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