James Ross Fortner

US Patent:

20190055665, Feb 21, 2019

Filed:

Aug 10, 2018

Appl. No.:

16/101291

Inventors:

- Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Aaron Berke - Portland OR, US
James Isaac Fortner - Newberg OR, US
Justin Oberst - Beaverton OR, US
Steven T. Mayer - Aurora OR, US
Robert Rash - West Linn OR, US

International Classification:

C25D 17/00
C25D 7/12

Abstract:

Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimize the degree to which electrolyte passes backwards from a cross flow manifold, through the ionically resistive element, and into an ionically resistive element manifold during electroplating. The membrane may be designed to route electrolyte in a desired manner in some embodiments. In these or other cases, one or more baffles may be provided in the ionically resistive element manifold to reduce the degree to which electrolyte is able to bypass the cross flow manifold by flowing back through the ionically resistive element and across the electroplating cell within the ionically resistive element manifold. These techniques can be used to improve the uniformity of electroplating results.

US Patent:

20180258546, Sep 13, 2018

Filed:

Mar 9, 2017

Appl. No.:

15/455011

Inventors:

- Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Lee Peng Chua - Beaverton OR, US
Robert Rash - West Linn OR, US
James Isaac Fortner - Newberg OR, US
Aaron Berke - Portland OR, US

International Classification:

C25D 5/02
C25D 17/00
C25D 17/06
C25D 21/12

Abstract:

Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the substrate. During plating, fluid may enter the cross flow manifold upward through the channels in the ionically resistive element, and (optionally) laterally through a cross flow side inlet. The flow paths combine in the cross flow manifold and exit at the cross flow outlet, which may be positioned opposite the cross flow inlet. In some embodiments, the ionically resistive element may include two or more flow regions, where the flow through each flow region is independently controllable. In these or other embodiments, an electrolyte jet may be included to flow additional electrolyte toward the substrate at a particular radial location or locations during plating. In some embodiments, the ionically resistive element may be omitted.

US Patent:

20170058417, Mar 2, 2017

Filed:

Oct 27, 2015

Appl. No.:

14/924124

Inventors:

- Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Steven T. Mayer - Aurora OR, US
Robert Rash - West Linn OR, US
James Isaac Fortner - Newberg OR, US
Lee Peng Chua - Beaverton OR, US

International Classification:

C25D 5/08
C25D 17/00

Abstract:

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. Also typically present is an edge flow element configured to direct electrolyte into a corner formed between the substrate and substrate holder. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths and the edge flow element result in improved plating uniformity, especially at the periphery of the substrate.

US Patent:

20160215408, Jul 28, 2016

Filed:

Jan 22, 2015

Appl. No.:

14/602910

Inventors:

- Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Steven T. Mayer - Lake Oswego OR, US
Lee Peng Chua - Beaverton OR, US
Aaron Berke - Portland OR, US
James Isaac Fortner - Newberg OR, US
Robert Rash - West Linn OR, US

Assignee:

LAM RESEARCH CORPORATION - Fremont CA

International Classification:

C25D 5/04
C25D 17/00

Abstract:

An apparatus for electroplating metal on a substrate while controlling plating uniformity includes in one aspect: a plating chamber having anolyte and catholyte compartments separated by a membrane; a primary anode positioned in the anolyte compartment; an ionically resistive ionically permeable element positioned between the membrane and a substrate in the catholyte compartment; and a secondary electrode configured to donate and/or divert plating current to and/or from the substrate, wherein the secondary electrode is positioned such that the donated and/or diverted plating current does not cross the membrane separating the anolyte and catholyte compartments, but passes through the ionically resistive ionically permeable element. In some embodiments the secondary electrode is an azimuthally symmetrical anode (e.g., a ring positioned in a separate compartment around the periphery of the plating chamber) that can be dynamically controlled during electroplating.

US Patent:

20160177466, Jun 23, 2016

Filed:

Dec 19, 2014

Appl. No.:

14/578068

Inventors:

- Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Aaron Berke - Portland OR, US
James Isaac Fortner - Newberg OR, US
Robert Rash - West Linn OR, US

International Classification:

C25D 17/00
C25D 7/12

Abstract:

Disclosed herein are methods of electroplating which may include placing a substrate, an anode, and an electroplating solution in an electroplating cell such that the substrate and the anode are located on opposite sides of a fluidically-permeable plate, setting the configuration of one or more seals which, when in their sealing configuration, substantially seal pores of the fluidically-permeable plate, and applying an electrical potential between the anode and the first substrate sufficient to cause electroplating on the first substrate such that the rate of electroplating in an edge region of the first substrate is affected by the configuration of the one or more seals. Also disclosed herein are apparatuses for electroplating which may include one or more seals for substantially sealing a subset of the pores in a fluidically-permeable plate whose sealing configuration affects a rate of electroplating in an edge region of the substrate.