James R Meyer

US Patent:

50898809, Feb 18, 1992

Filed:

Jun 7, 1989

Appl. No.:

7/362822

Inventors:

James A. Meyer - Campbell CA
Frank Mikalauskas - San Jose CA
Howard L. Parks - Los Gatos CA

Assignee:

Amdahl Corporation - Sunnyvale CA

International Classification:

H01L 2316

US Classification:

357 75

Abstract:

A multilayer pressure stack (microstack) has a plurality of layers formed of a material that may have a high time-dependent deformation factor and a plurality of segments formed in each layer. Each segment comprises a conductive material having a low time-dependent deformation factor and pressure is provided along a column of aligned segments to establish electrical interconnections between the segments in various layers. Interposers formed of non-conductive material may be provided in selected segments to form points of electrical isolation. The plurality of layers, or wafers, includes signal wafers and ground/voltage wafers. The signal wafers are formed of a low dielectric constant material to optimize the propagation velocity of signals traveling in signal traces connecting selected segments in the signal wafer. More than 100 wafers may be provided in a microstack and repairs and revisions of conductor routing are easily accomplished by substituting new wafers within the microstack.

US Patent:

20140353019, Dec 4, 2014

Filed:

May 30, 2013

Appl. No.:

13/906229

Inventors:

Deepak Arora - Chandler AZ, US
Daniel N. Sobieski - Phoenix AZ, US
Dilan Seneviratne - Chandler AZ, US
Ebrahim Andideh - Tempe AZ, US
James C. Meyer - Tualatin OR, US

International Classification:

C23C 14/22
H05K 1/11
H01L 21/02
H05K 1/03
C23C 14/34
C23C 14/14

US Classification:

174258, 156247, 427124, 2041921, 174262

Abstract:

Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.