James C O'Keefe

US Patent:

41521722, May 1, 1979

Filed:

Dec 29, 1977

Appl. No.:

5/865545

Inventors:

Niel F. Jensen - Phoenix AZ
James E. O'Keefe - Phoenix AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

B08B 100

US Classification:

134 6

Abstract:

Method and apparatus for cleaning the top surfaces of raised input/output (I/O) terminals of semiconductor elements of a semiconductor wafer prior to electronic leads being reflow bonded to such terminals. The top surfaces of the I/O terminals substantially lie in I/O plane. The wafer is mounted on a work handler and the handler is fixedly mounted on a vacuum plate holder which is mounted for oscillatory movement in a plane at a predetermined amplitude and frequency. A vinyl eraser having a planar surface of greater area than the area of the wafer occupied by the elements is mounted directly above the wafer. The eraser is operatively connected to an actuator which presses the planar surface of the eraser against the top surfaces of the I/O terminals with a predetermined force. Oscillation of the work handler holder with respect to the eraser for a predetermined time causes the top surfaces of the I/O terminals to rub against the planar surface of the eraser, which cleans them without the eraser contacting the upper surface of the semiconductor elements or damaging the I/O terminals, and results in the I/O terminals being ready to be reflow bonded to electronic leads without further preparation.

US Patent:

41729072, Oct 30, 1979

Filed:

Dec 29, 1977

Appl. No.:

5/865546

Inventors:

Arthur H. Mones - Phoenix AZ
James E. O'Keefe - Phoenix AZ

Assignee:

Honeywell Information Systems Inc. - Phoenix AZ

International Classification:

B05D 512
H01L 2188

US Classification:

427 96

Abstract:

A method of protecting from physical damage the upper surface of medium and large scale integrated IC circuit chips. Certain types of IC chips are provided with a plurality of input/output terminals, or bumps, which project above the upper surface of the chips on which they are formed. The upper surface of each such chip, including its bumps, are spin coated with a thin adhesion promoter which is then dried. The chips and its terminals are next spin coated with a layer of a heat curable resin which is partially cured. The resin and the adhesion promoter are then removed from the upper surfaces of the bump by rubbing with a soft abrasive material. The resin remaining on each IC chip is then finally cured.