James Hughey Poore

US Patent:

20040075982, Apr 22, 2004

Filed:

Oct 21, 2002

Appl. No.:

10/277185

Inventors:

David Kim - San Jose CA, US
William Ruckman - San Jose CA, US
Wenjun Chen - Fremont CA, US
James Poore - San Jose CA, US

International Classification:

G06F001/20
H05K007/20

US Classification:

361/687000, 361/718000

Abstract:

Disclosed are novel methods and apparatus for provision of a heat dissipation device with improved EMI suppression characteristics. In accordance with an embodiment of the present invention, an apparatus is disclosed. The apparatus may include a printed circuit board, which forms at least one grounding pad and at least one mounting hole. The apparatus may further include an integrated circuit, a heat dissipation device mounted on the integrated circuit, and a frame mounted on the printed circuit board through the mounting hole. The frame may include at least one frame leg in electrical contact with the grounding pad. The frame may form an electromagnetic interference (EMI) shield to limit an EMI leakage generated by the integrated circuit.

Address:

12150 Steffs Ct, San Martin, CA 95046

VIN:

1FAHP25W18G181755

Make:

FORD

Model:

TAURUS

Year:

2008