James E Roberson

US Patent:

6817092, Nov 16, 2004

Filed:

Oct 4, 2001

Appl. No.:

09/972697

Inventors:

James Keith Custer - Fair Oaks CA
James Hiram Roberson - Placerville CA
William Kerr Veitschegger - Folsom CA

Assignee:

Powerwave Technologies, Inc. - Santa Ana CA

International Classification:

H01R 906

US Classification:

29843, 29840, 29842, 29837, 29851, 2281801, 2281791, 361803, 439 83

Abstract:

A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

US Patent:

20020052146, May 2, 2002

Filed:

Nov 5, 1999

Appl. No.:

09/434682

Inventors:

JAMES KEITH CUSTER - FAIR OAKS CA, US
JAMES HIRAM ROBERSON - PLACERVILLE CA, US
WILLIAM KERR VEITSCHEGGER - FOLSOM CA, US

International Classification:

H05K001/00

US Classification:

439/625000

Abstract:

A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

US Patent:

20170187451, Jun 29, 2017

Filed:

Oct 14, 2014

Appl. No.:

15/312603

Inventors:

- New York NY, US
Eddie Rodgers - Folsom CA, US
James H. Roberson - Placerville CA, US

International Classification:

H04B 7/185
H05K 1/02

Abstract:

A satellite is configured for use in space so as to receive RF signals, convert them to a different frequency range, and retransmit the converted RF signals. The satellite comprises a payload area supporting a motherboard structure with a plurality of frequency converters supported on it. The frequency converters are each connected with an antenna system of the satellite so that each of them receives a respective RF input signal. A local oscillator source supported on said motherboard structure generates a local oscillator signal, and a motherboard in the motherboard structure receives the local oscillator signal and transmits it through the motherboard to each of the frequency converters. The frequency converters each convert the respective RF input signal to a respective RF output signal using the local oscillator signal and transmit the RF output signal to the antenna system so as to be transmitted wirelessly.