James J Stack

US Patent:

6407341, Jun 18, 2002

Filed:

Apr 25, 2000

Appl. No.:

09/557802

Inventors:

Donald O. Anstrom - Endicott NY
Bruce J. Chamberlin - Kirkwood NY
John M. Lauffer - Waverly NY
Voya R. Markovich - Endwell NY
Douglas O. Powell - Endicott NY
Joseph P. Resavy - Endicott NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 114

US Classification:

174255, 174262, 29846, 29852, 361780

Abstract:

Conductive substructures of a multilayered laminate and associated methods of fabrication. The conductive substructures include a 0S1P substructure, a 0S3P substructure, and a 2S1P substructure, in accordance with the notation nSmP, wherein n and m are non-negative integers, wherein S stands for âsignal plane,â and wherein P stands for âpower plane. â A signal plane is characterized by its inclusion of a layer comprising conductive circuitry. A power plane is characterized by its inclusion of a continuously conductive layer. Thus, a 0S1P substructure includes 0 signal planes and 1 power plane (n=0, m=1). A 0S3P substructure includes 0 signal planes and 3 power plane (n=0, m=3) with a dielectric layer between each pair of power planes. A 2S1P substructure includes 2 signal planes and 1 power plane (n=2, m=1) with a dielectric layer between the power plane and each signal plane. A multilayered laminate includes a stacked substructure configuration having any combination of 0S1P, 0S3P, and 2S1P substructures with dielectric material insulatively separating the substructures from one another.

US Patent:

6426466, Jul 30, 2002

Filed:

Feb 9, 2000

Appl. No.:

09/501480

Inventors:

Bruce J. Chamberlin - Kirkwood NY
John M. Lauffer - Waverly NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NJ

International Classification:

H05K 102

US Classification:

174255, 174261, 361807, 361808

Abstract:

A printed wiring board structure having peripheral power input. A printed wiring board having internal conductive layers, wherein each internal conductive layer contains a plurality of tabs extending therefrom. Tabs of similar voltage are vertically aligned within the printed wiring board. A frame within which the printed wiring board is mounted is also provided. The frame, having connections mounted within an inner surface of the frame, electrically contacts the tabs along the periphery of the printed wiring board.

US Patent:

6565367, May 20, 2003

Filed:

Jan 17, 2001

Appl. No.:

09/764466

Inventors:

Mark Budman - Vestal NY
Bruce Chamberlin - Vestal NY
Li Li - Plano TX
James Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1200

US Classification:

439 82, 439161, 439479, 439567

Abstract:

A compliant pin contact and assembly utilizing same in which the contact is comprised of two layers, each of a different material and coefficient of thermal expansion (CTE) than the other, to enable insertion within an opening in either a âcoldâ or âhotâ state to thereby expand and positively engage the openings walls, thereby securedly holding the pin in position. Representative materials include Invar and aluminum.

US Patent:

6576013, Jun 10, 2003

Filed:

Jan 8, 2002

Appl. No.:

10/041342

Inventors:

Mark Budman - Vestal NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

A61F 214

US Classification:

623 664, 446392

Abstract:

An ocular prosthesis displays an iris and pupil image on a color liquid crystal array display device. A plurality of iris images are stored as data in a memory. Ambient light level is detected by a light sensor device. An image is selected based on light level and sent to the array display device.

US Patent:

6593534, Jul 15, 2003

Filed:

Mar 19, 2001

Appl. No.:

09/812261

Inventors:

Gerald W. Jones - Apalachin NY
John M. Lauffer - Waverly NY
Voya R. Markovich - Endwell NY
Thomas R. Miller - Endwell NY
James P. Paoletti - Endwell NY
Konstantinos I. Papathomas - Endicott NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

174262, 174263, 174255, 361772

Abstract:

A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.

US Patent:

6784377, Aug 31, 2004

Filed:

Jul 25, 2002

Appl. No.:

10/205102

Inventors:

Bruce John Chamberlin - Vestal NY
Mark Kenneth Hoffmeyer - Rochester MN
Wai Mon Ma - Poughkeepsie NY
Arch Nuttall - Hyde Park NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1204

US Classification:

174265, 174262

Abstract:

A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

US Patent:

6832436, Dec 21, 2004

Filed:

Mar 7, 2002

Appl. No.:

10/094025

Inventors:

Donald O. Anstrom - Endicott NY
Bruce J. Chamberlin - Kirkwood NY
John M. Lauffer - Waverly NY
Voya R. Markovich - Endwell NY
Douglas O. Powell - Endicott NY
Joseph P. Resavy - Endicott NY
James R. Stack - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01K 310

US Classification:

29852, 29846, 29831, 29829, 174261

Abstract:

A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed through the sheet of conductive material. A first layer of dielectric material is applied to the exposed first surface, after the forming the hole. No material was inserted into the hole before applying the first layer of dielectric material to the exposed first surface. To form the electrical structure, a multilayered laminate that includes a plurality of substructures is formed such that a dielectric layer insulatively separates each pair of successive substructures.

US Patent:

6912780, Jul 5, 2005

Filed:

Jun 3, 2004

Appl. No.:

10/860427

Inventors:

Bruce John Chamberlin - Kirkwood NY, US
Mark Kenneth Hoffmeyer - Rochester MN, US
Wai Mon Ma - Poughkeepsie NY, US
Arch Nuttall - Hyde Park NY, US
James R. Stack - Endicott NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01K003/10

US Classification:

29853, 174262, 29852

Abstract:

A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.