Jamie M Sullivan

US Patent:

6775051, Aug 10, 2004

Filed:

May 3, 2002

Appl. No.:

10/138782

Inventors:

Jamie Sullivan - Sunnyvale CA
Ralph Johnson - Los Gatos CA
John Gibson - Sunnyvale CA
Mingguang Li - Sunnyvale CA
Eric Vella - Mt. View CA

Assignee:

KLA-Tencor Technologies - Milpitas CA

International Classification:

G02F 133

US Classification:

359312, 359305, 359308, 359286, 369116, 369 97, 369121

Abstract:

Systems and methods for scanning a beam of light over a specimen are provided. A system may include a pre-scan acousto-optical deflector (AOD) configured to deflect a beam of light, a second AOD configured as a traveling lens to focus the scanning beam, a relay lens, and an objective lens. The relay lens may be centered on the scan line produced by the second AOD, while the objective lens may be substantially de-centered with respect to the relay lens to produce a telecentric scanning spot with no field tilt. The system may modulate the amplitude of the sound wave in the first AOD to compensate for attenuation in the second AOD. The system may pre-fill one chirp packet in the second AOD while another chirp packet is scanning to substantially reduce a delay between consecutive scans.

US Patent:

6833913, Dec 21, 2004

Filed:

Jun 24, 2002

Appl. No.:

10/180807

Inventors:

Ralph C. Wolf - Palo Alto CA
Eva L. Benitez - Sunnyvale CA
Dongsheng Don Chen - Union City CA
John D. Greene - Santa Cruz CA
Jamie M. Sullivan - Sunnyvale CA
Eric N. Vella - Mountain View CA
Khiem D. Vo - Milpitas CA

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 2188

US Classification:

3562372, 250214 AG

Abstract:

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e. g. , scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor.

US Patent:

6922236, Jul 26, 2005

Filed:

Jul 10, 2002

Appl. No.:

10/192813

Inventors:

Mehdi Vaez-Iravani - Los Gatos CA, US
Stan Stokowski - Danville CA, US
Steven Biellak - Sunnyvale CA, US
Jamie Sullivan - Sunnyvale CA, US
Keith Wells - Santa Cruz CA, US
Mehrdad Nikoonahad - Menlo Park CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01N021/88

US Classification:

3562372

Abstract:

Systems and methods for inspecting a surface of a specimen such as a semiconductor wafer are provided. A system may include an illumination system configured to direct a first beam of light to a surface of the specimen at an oblique angle of incidence and to direct a second beam of light to a surface of the specimen at a substantially normal angle. The system may also include a collection system configured to collect at least a portion of the first and second beams of light returned from the surface of the specimen. In addition, the system may include a detection system. The detection system may be configured to process the collected portions of the first and second beams of light. In this manner, a presence of defects on the specimen may be detected from the collected portions of the first and second beams of light.

US Patent:

7012683, Mar 14, 2006

Filed:

Nov 18, 2004

Appl. No.:

10/993473

Inventors:

Ralph C. Wolf - Palo Alto CA, US
Eva L. Benitez - Sunnyvale CA, US
Dongsheng (Don) Chen - Union City CA, US
John D. Greene - Santa Cruz CA, US
Jamie M. Sullivan - Sunnyvale CA, US
Eric N. Vella - Mountain View CA, US
Khiem D. Vo - Milpitas CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 21/88

US Classification:

3562372

Abstract:

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e. g. , scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor.

US Patent:

7535563, May 19, 2009

Filed:

Aug 15, 2006

Appl. No.:

11/464567

Inventors:

Grace Hsiu-Ling Chen - San Jose CA, US
Tao-Yi Fu - Fremont CA, US
Jamie Sullivan - Eugene OR, US
Shing Lee - Fremont CA, US
Greg Kirk - Pleasanton CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 21/00

US Classification:

3562375, 3562371

Abstract:

Systems configured to inspect a specimen are provided. One system includes an illumination subsystem configured to illuminate a two-dimensional field of view on the specimen. The system also includes a collection subsystem configured to collect light scattered from the specimen. In addition, the system includes an array of micro-mirrors configured to reflect a two-dimensional pattern of light diffracted from periodic structures on the specimen out of the optical path of the system without reflecting light across an entire dimension of the array out of the optical path. The system further includes a detection subsystem configured to generate output responsive to light reflected by the array into the optical path. The output can be used to detect defects on the specimen. In one embodiment, the system includes an optical element configured to increase the uniformity of the wavefront of the light reflected by the array into the optical path.

US Patent:

20030184739, Oct 2, 2003

Filed:

Jun 4, 2002

Appl. No.:

10/163398

Inventors:

Dieter Wilk - San Jose CA, US
Anlun Tang - Pleasanton CA, US
Eric Vella - Mountain View CA, US
J. Runyon - Fremont CA, US
Jamie Sullivan - Sunnyvale CA, US

Assignee:

KLA-Tencor Technologies Corporation

International Classification:

G01N021/00

US Classification:

356/237100

Abstract:

Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 per square.

US Patent:

20040001198, Jan 1, 2004

Filed:

Jun 4, 2002

Appl. No.:

10/163762

Inventors:

Dieter Wilk - San Jose CA, US
Anlun Tang - Pleasanton CA, US
Eric Vella - Mountain View CA, US
Rex Runyon - Fremont CA, US
Jamie Sullivan - Sunnyvale CA, US
Ralph Johnson - Los Gatos CA, US

Assignee:

KLA-Tencor Technologies Corporation

International Classification:

G01N021/00

US Classification:

356/237300

Abstract:

Disclosed are mechanisms for selectively filtering spatial portions of light emanating from a sample under inspection within an optical system. In one embodiment, a programmable spatial filter (PSF) is constructed from materials that are compatible with light in a portion of the UV wavelength range. In a specific implementation, the PSF is constructed from a UV compatible material, such as a polymer stabilized liquid crystal material. In a further aspect, the PSF also includes a pair of plates that are formed from a UV grade glass. The PSF may also include a relatively thin first and second ITO layer that results in a sheet resistance between about 100 and about 300 per square. The PSF provides selective filtering in two directions. In other words, the PSF provides two dimensional filtering.

US Patent:

20130169957, Jul 4, 2013

Filed:

Nov 13, 2012

Appl. No.:

13/675687

Inventors:

Grace H. Chen - Los Gatos CA, US
Kai Cao - Fremont CA, US
Jamie M. Sullivan - Sunnyvale CA, US
Paul J. Donders - Fremont CA, US
Derek C. Mackay - Menlo Park CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G01N 21/88

US Classification:

3562371

Abstract:

Disclosed are apparatus and methods for inspecting or measuring a specimen. An incident beam is directed across a plurality of consecutive scan portions of a specimen so that an output beam profile from each scan portion is consecutively collected by a photomultiplier tube (PMT), and the scan portions include at least one or more first scan portions and a next scan portion that is scanned after the one or more first scan portions. After or while the incident beam is directed to the one or more first scan portions of the specimen, an output signal for each first scan portion is obtained based on the output beam profile that is collected by the PMT for each first scan portion. An expected output beam profile for the next scan portion is determined based on the output signal that is obtained for each one or more first scan portions. As the incident beam is directed towards the next scan portion, a gain input to the PMT for the next scan portion is set based on the expected output beam profile so that the gain for such next scan portion results in a measured signal at the PMT that is within a predefined specification of the PMT or other hardware components that receive a measured signal from the PMT.