Jane A Shaw

US Patent:

55828582, Dec 10, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/474985

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

427 96

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

55912850, Jan 7, 1997

Filed:

Jul 24, 1995

Appl. No.:

8/475670

Inventors:

Bodil E. Braren - Hartsdale NY
Shahrokh Daijavad - Peekskill NY
Elizabeth Foster - Friendsville PA
James L. Hedrick - Oakland CA
Jeffrey C. Hedrick - Peekskill NY
Rodney T. Hodgson - Ossining NY
Ashit A. Mehta - Vestal NY
Steven E. Molis - Brewster NY
Jane M. Shaw - Ridgefield CT
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

B32B 3128
B32B 2716

US Classification:

156 622

Abstract:

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

US Patent:

53978633, Mar 14, 1995

Filed:

Aug 13, 1992

Appl. No.:

7/929313

Inventors:

Bodil E. Braren - Hartsdale NY
Shahrokh Daijavad - Peekskill NY
Elizabeth Foster - Friendsville PA
James L. Hedrick - Oakland CA
Jeffrey C. Hedrick - Peekskill NY
Rodney T. Hodgson - Ossining NY
Ashit A. Mehta - Vestal NY
Steven E. Molis - Brewster NY
Jane M. Shaw - Ridgefield CT
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 103

US Classification:

174258

Abstract:

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

US Patent:

55718523, Nov 5, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/472120

Inventors:

Bodil E. Braren - Hartsdale NY
Shahrokh Daijavad - Peekskill NY
Elizabeth Foster - Friendsville PA
James L. Hedrick - Oakland CA
Jeffrey C. Hedrick - Peekskill NY
Rodney T. Hodgson - Ossining NY
Ashit A. Mehta - Vestal NY
Steven E. Molis - Brewster NY
Jane M. Shaw - Ridgefield CT
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C08J 328

US Classification:

523215

Abstract:

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

US Patent:

55568998, Sep 17, 1996

Filed:

Nov 30, 1994

Appl. No.:

8/346766

Inventors:

Bodil E. Braren - Hartsdale NY
Shahrokh Daijavad - Peekskill NY
Elizabeth Foster - Friendsville PA
James L. Hedrick - Oakland CA
Jeffrey C. Hedrick - Peekskill NY
Rodney T. Hodgson - Ossining NY
Ashit A. Mehta - Vestal NY
Steven E. Molis - Brewster NY
Jane M. Shaw - Ridgefield CT
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C08J 518

US Classification:

523215

Abstract:

Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400. degree. C. at 65. degree. -200. degree. C. /second.

US Patent:

53266439, Jul 5, 1994

Filed:

Oct 7, 1991

Appl. No.:

7/771929

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Cheongryang, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 900

US Classification:

4284722

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

55995829, Feb 4, 1997

Filed:

Jun 7, 1995

Appl. No.:

8/475412

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

4272071

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide.

US Patent:

55697399, Oct 29, 1996

Filed:

Feb 17, 1994

Appl. No.:

8/197941

Inventors:

Eleftherios Adamopoulos - Bronx NY
Kang-Wook Lee - Yorktown Heights NY
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C08F 834

US Classification:

528353

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.