Janet Denise Kirkland

US Patent:

6936501, Aug 30, 2005

Filed:

Apr 5, 2004

Appl. No.:

10/818981

Inventors:

Seah Sun Too - San Jose CA, US
James Hayward - Santa Clara CA, US
Janet D. Kirkland - Fremont CA, US

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L023/12

US Classification:

438122, 438106, 257704, 257706, 257713, 257724

Abstract:

A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting surface. It is flip-chip mounted to a support substrate so the active surface is adjacent the support substrate. A passive or active circuit element may be mounted to the support substrate. The mounting surface of the semiconductor chip has a radius of curvature. A thermal interface material is dispensed on the mounting surface of the semiconductor chip. A lid is coupled to the support substrate via a lid adhesive. A portion of the lid has a radius of curvature that corresponds to the radius of curvature of the semiconductor chip. A force is applied to the lid so that it contacts the thermal interface material and urges the interface material to the sides of the semiconductor chip. The force causes wetting of the thermal interface material.

US Patent:

7651938, Jan 26, 2010

Filed:

Jun 7, 2006

Appl. No.:

11/422795

Inventors:

Seah Sun Too - San Jose CA, US
Hsiang Wan Liau - Penang, MY
Janet Kirkland - Fremont CA, US
Tek Seng Tan - Penang, MY
Raj N. Master - San Jose CA, US

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 21/44
H01L 23/12

US Classification:

438615, 438612, 438108, 257704, 257779, 257778, 257E23109

Abstract:

Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.

US Patent:

7999394, Aug 16, 2011

Filed:

Dec 15, 2009

Appl. No.:

12/638112

Inventors:

Seah Sun Too - San Jose CA, US
Hsiang Wan Liau - Penang, MY
Janet Kirkland - Fremont CA, US
Tek Seng Tan - Penang, MY
Raj N. Master - San Jose CA, US

Assignee:

Advanced Micro Devices, Inc. - Sunnvale CA

International Classification:

H01L 23/48
H01L 23/12

US Classification:

257779, 25713, 25778, 25704, 25E23109

Abstract:

Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.

US Patent:

8497162, Jul 30, 2013

Filed:

Apr 21, 2006

Appl. No.:

11/379741

Inventors:

Seah Sun Too - San Jose CA, US
Janet Kirkland - Fremont CA, US

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 21/00

US Classification:

438118

Abstract:

Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.

US Patent:

20130309814, Nov 21, 2013

Filed:

Jul 26, 2013

Appl. No.:

13/952392

Inventors:

Seah Sun Too - Sammamish WA, US
Janet Kirkland - Sonora CA, US

International Classification:

H01L 21/50

US Classification:

438118

Abstract:

Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.

US Patent:

57898138, Aug 4, 1998

Filed:

Sep 30, 1996

Appl. No.:

8/724076

Inventors:

Janet Kirkland - Fremont CA
Mark R. Schneider - San Jose CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2328
H01L 2310
H01L 2348
H01L 3902

US Classification:

257712

Abstract:

An integrated circuit package having a die supported on a ball grid array substrate and wire bonds electrically connecting the die to the substrate. Supported on the substrate is a lock ring having a threaded opening encircling the die. Encapsulant covers the die and the wire bonds and adheres the lock ring to the substrate. A heat sink having a threaded portion can be threaded into the lock ring into an operative cooling position relative to the die and subsequently to an unthreaded removed position. When in the latter position, a repair station can be positioned over the package and the solder balls are accessible for hot gas melting thereof for removal (or replacement) of the package from the underlying motherboard.

US Patent:

58858482, Mar 23, 1999

Filed:

Jul 28, 1997

Appl. No.:

8/901489

Inventors:

Janet Kirkland - Fremont CA
Mark R. Schneider - San Jose CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438106

Abstract:

An integrated circuit package having a die supported on a ball grid array substrate and wire bonds electrically connecting the die to the substrate. Supported on the substrate is a lock ring having a threaded opening encircling the die. Encapsulant covers the die and the wire bonds and adheres the lock ring to the substrate. A heat sink having a threaded portion can be threaded into the lock ring into an operative cooling position relative to the die and subsequently to an unthreaded removed position. When in the latter position, a repair station can be positioned over the package and the solder balls are accessible for hot gas melting thereof for removal (or replacement) of the package from the underlying motherboard.