Jason A Burton

US Patent:

20040257769, Dec 23, 2004

Filed:

Jun 20, 2003

Appl. No.:

10/600127

Inventors:

Douglas Heirich - Palo Alto CA, US
Steven Holmes - Mountain View CA, US
James Smeenge - Campbell CA, US
Jason Burton - Sunnyvale CA, US

International Classification:

H05K007/20

US Classification:

361/704000, 361/719000

Abstract:

A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading. The system and method in accordance with the present invention provides features that ensure full and consistent engagement of the high density signal connectors, while preventing damage to these fragile components in installation and service. Finally, the system and method in accordance with the present invention provides a quick and easy means of assembly of the system, to enable secure reliable interconnection of the printed circuit board with the suspended circuit board (daughter board), while supporting the cooling system heatsink.