Jason D Colvin

US Patent:

8415184, Apr 9, 2013

Filed:

May 9, 2011

Appl. No.:

13/103561

Inventors:

Jason D. Colvin - Sykesville MD, US
Andrew DeHennis - Germantown MD, US
Jody L. Krsmanovic - McLean VA, US

Assignee:

Sensors for Medicine and Science, Inc. - Germantown MD

International Classification:

H01L 27/15

US Classification:

438 27, 257 99, 257E33056, 257E33067, 356442

Abstract:

A light emitting diode for harsh environments includes a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, several bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a micro post, formed on each bonding pad, for electrically connecting the light emitting diode to a printed circuit board. An underfill layer may be provided between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate. Additionally, a diffuser may be mounted to a top surface of the light emitting diode substrate to diffuse the light emitted through the top surface.

US Patent:

20080218759, Sep 11, 2008

Filed:

Mar 6, 2008

Appl. No.:

12/043289

Inventors:

Jason D. Colvin - Sykesville MD, US
Arthur E. Colvin - Mt. Airy MD, US
Andrew DeHennis - Germantown MD, US
Jody L. Krsmanovic - McLean VA, US

Assignee:

SENSORS FOR MEDICINE AND SCIENCE, INC. - Germantown MD

International Classification:

G01N 21/00
H01L 33/00

US Classification:

356442, 257 98, 438 27, 257E33056, 257E33067

Abstract:

A light emitting diode for harsh environments includes a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, several bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a micro post, formed on each bonding pad, for electrically connecting the light emitting diode to a printed circuit board. An underfill layer may be provided between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate. Additionally, a diffuser may be mounted to a top surface of the light emitting diode substrate to diffuse the light emitted through the top surface.

US Patent:

20100298674, Nov 25, 2010

Filed:

Apr 21, 2010

Appl. No.:

12/764389

Inventors:

Jason D. Colvin - Vienna VA, US

Assignee:

Sensors for Medicine & Science, Inc. - Germantown MD

International Classification:

A61B 5/145
A61B 5/1459

US Classification:

600316, 600365

Abstract:

An implantable device with in vivo functionality, where the functionality of the device is negatively affected by the inflammation reaction generally associated with tissue injury, encapsulated by a protective coating that prevents damage to the device from any inflammation reactions. The protective coating is designed to persist for a set period of time, generally until after the inflammation reaction of the surrounding in vivo environment in response to the injury caused by the implantation procedure has concluded. The protective coating is further designed to “resorb” (i.e. to dissociate from the device, dissolve, and be absorbed into the surrounding environment) after a set period of time, allowing the device to perform its in vivo functionality unhindered without loss of performance.