Jason M Layton

US Patent:

6343183, Jan 29, 2002

Filed:

Jun 27, 2000

Appl. No.:

09/605094

Inventors:

Michael W. Halpin - Phoenix AZ
Mark R. Hawkins - Gilbert AZ
Derrick W. Foster - Scottsdale AZ
Robert M. Vyne - Gilbert AZ
John F. Wengert - Jacksonville OR
Cornelius A. van der Jeugd - Portland OR
Loren R. Jacobs - Mesa AZ
Frank B. M. Van Bilsen - Phoenix AZ
Matthew Goodman - Tempe AZ
Hartmann Glenn - Phoenix AZ
Jason M. Layton - Chandler AZ

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

A21B 200

US Classification:

392416, 392418, 219390, 219411, 118725, 118666, 118696

Abstract:

A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.

US Patent:

6454866, Sep 24, 2002

Filed:

Jul 10, 2000

Appl. No.:

09/614481

Inventors:

Michael W. Halpin - Phoenix AZ
Mark R. Hawkins - Gilbert AZ
Derrick W. Foster - Scottsdale AZ
Robert M. Vyne - Gilbert AZ
John F. Wengert - Jacksonville OR
Cornelius A. van der Jeugd - Portland OR
Loren R. Jacobs - Mesa AZ
Frank B. M. Van Bilsen - Phoenix AZ
Matthew Goodman - Tempe AZ
Hartmann Glenn - Phoenix AZ
Jason M. Layton - Chandler AZ

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

C23C 1600

US Classification:

118730, 118715, 118725, 118728, 118500

Abstract:

A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.

US Patent:

6491757, Dec 10, 2002

Filed:

Aug 17, 2001

Appl. No.:

09/932795

Inventors:

Michael W. Halpin - Phoenix AZ
Mark R. Hawkins - Gilbert AZ
Derrick W. Foster - Scottsdale AZ
Robert M. Vyne - Gilbert AZ
John F. Wengert - Jacksonville OR
Cornelius A. van der Jeugd - Portland OR
Loren R. Jacobs - Mesa AZ
Frank B. M. Van Bilsen - Phoenix AZ
Matthew Goodman - Tempe AZ
Hartmann Glenn - Phoenix AZ
Jason M. Layton - Chandler AZ

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

C23C 1600

US Classification:

118666, 118725, 118696, 15634524, 392407, 392411, 392416, 392418, 219390, 219395, 219411, 219412, 219413

Abstract:

An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. The controller is configured to vary the ratio during a high temperature processing cycle of a substrate to thereby vary the ratio of the heat provided by the heat sources during the cycle.

US Patent:

7655093, Feb 2, 2010

Filed:

Jan 29, 2007

Appl. No.:

11/668409

Inventors:

Michael W. Halpin - Phoenix AZ, US
Mark R. Hawkins - Gilbert AZ, US
Derrick W. Foster - Scottsdale AZ, US
Robert M. Vyne - Gilbert AZ, US
John F. Wengert - Jacksonville OR, US
Cornelius A. van der Jeugd - Portland OR, US
Loren R. Jacobs - Mesa AZ, US
Frank B. M. Van Bilsen - Phoenix AZ, US
Matthew Goodman - Tempe AZ, US
Hartmann Glenn - Phoenix AZ, US
Jason M. Layton - Chandler AZ, US

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

H01L 21/00
C23C 14/00
C23C 16/00

US Classification:

118728, 118724, 118725, 15634551, 15634552, 15634553

Abstract:

A wafer support system comprising a susceptor having top and bottom sections and gas flow passages therethrough. One or more spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.

US Patent:

20030075274, Apr 24, 2003

Filed:

Sep 13, 2002

Appl. No.:

10/243579

Inventors:

Michael Halpin - Phoenix AZ, US
Mark Hawkins - Gilbert AZ, US
Derrick Foster - Scottsdale AZ, US
Robert Vyne - Gilbert AZ, US
John Wengert - Jacksonville OR, US
Cornelius van der Jeugd - Portland OR, US
Loren Jacobs - Mesa AZ, US
Frank Van Bilsen - Phoenix AZ, US
Matthew Goodman - Tempe AZ, US
Hartmann Glenn - Phoenix AZ, US
Jason Layton - Chandler AZ, US

International Classification:

C23C014/00
C23F001/00
C23C016/00

US Classification:

156/345510, 118/728000, 156/345500, 118/050100

Abstract:

A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer. Short purge channels may be provided to deliver some of the sweep gas to regions surrounding the spacers to cause a continuous flow of protective purge gas around the spacers. A common bottom section may cooperate with a plurality of different top sections to form segmented susceptors suitable for supporting various sized wafers.

US Patent:

20040198153, Oct 7, 2004

Filed:

Aug 18, 2003

Appl. No.:

10/642799

Inventors:

Michael Halpin - Phoenix AZ, US
Mark Hawkins - Gilbert AZ, US
Derrick Foster - Scottsdale AZ, US
Robert Vyne - Gilbert AZ, US
John Wengert - Jacksonville OR, US
Cornelius Jeugd - Portland OR, US
Loren Jacobs - Mesa AZ, US
Frank Van Bilsen - Phoenix AZ, US
Matthew Goodman - Tempe AZ, US
Hartmann Glenn - Phoenix AZ, US
Jason Layton - Chandler AZ, US

International Classification:

B24B007/00

US Classification:

446/259000, 451/064000

Abstract:

A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer. Short purge channels may be provided to deliver some of the sweep gas to regions surrounding the spacers to cause a continuous flow of protective purge gas around the spacers. A common bottom section may cooperate with a plurality of different top sections to form segmented susceptors suitable for supporting various sized wafers.

US Patent:

61210617, Sep 19, 2000

Filed:

Nov 2, 1998

Appl. No.:

9/184491

Inventors:

Franciscus Bernardus Maria Van Bilsen - Phoenix AZ
Jason Mathew Layton - Chandler AZ
Ivo Raaijmakers - Phoenix AZ

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

H01L 2166
G01R 3126

US Classification:

438 14

Abstract:

A method is provided for treating wafers on a low mass support. The method includes mounting a temperature sensor in proximity to the wafer, which is supported on the low mass support, such that the sensor is only loosely thermally coupled to the wafer. A temperature controller is programmed to critically tune the wafer temperature in a temperature ramp, though the controller directly controls the sensor temperature. A wafer treatment, such as epitaxial silicon deposition, is started before the sensor temperature has stabilized. Accordingly, significant time is saved for the treatment process, and wafer throughput improved.

US Patent:

61137022, Sep 5, 2000

Filed:

Sep 4, 1997

Appl. No.:

8/923241

Inventors:

Michael W. Halpin - Phoenix AZ
Mark R. Hawkins - Gilbert AZ
Derrick W. Foster - Scottsdale AZ
Robert M. Vyne - Gilbert AZ
John F. Wengert - Jacksonville OR
Cornelius A. van der Jeugd - Portland OR
Loren R. Jacobs - Mesa AZ
Frank B. M. Van Bilsen - Phoenix AZ
Matthew Goodman - Tempe AZ
Hartmann Glenn - Phoenix AZ
Jason M. Layton - Chandler AZ

Assignee:

ASM America, Inc. - Phoenix AZ

International Classification:

C23C 1600

US Classification:

118725

Abstract:

A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.