Jason Jianhorng Lin

US Patent:

6665432, Dec 16, 2003

Filed:

Feb 1, 2000

Appl. No.:

09/496013

Inventors:

David M. W. Evans - Braddon, ACT 2601, AU
Jason Z. Lin - Saratoga CA 95070

International Classification:

G06K 900

US Classification:

382141, 382278

Abstract:

The present invention is a hybrid technique for finding defects on digitized device images using a combination of spatial domain and frequency domain techniques. The two dimensional spectra of two images are found using Fourier like transforms. Any strong harmonics in the spectra are removed, using the same spectral filter on both spectra. The images are then aligned, transformed back to the spatial domain, and subtracted. The resulting spectrally-filtered difference image is thresholded and analyzed for defects. Use of the hybrid technique of the present invention to process digitized images results in the highest-performance and most flexible defect detection system. It is the best performer on both array and random devices, and it can cope with problems such as shading variations and the dark-bright problem that no other technique can address. The hybrid technique of the present invention also uses frequency domain techniques to align the images with fewer errors than spatial domain techniques of similar or lesser complexity. Further, the relative offsets of the pairs of images are determined by frequency domain techniquesâand this method may be the most accurate and the least expensive.

US Patent:

7024339, Apr 4, 2006

Filed:

Oct 18, 2004

Appl. No.:

10/967838

Inventors:

Krishnamurthy Bhaskar - San Jose CA, US
Mark J. Roulo - Mountain View CA, US
John S. Taylor - San Jose CA, US
Lawrence R. Miller - Los Altos CA, US
Paul T. Russell - Scotts Valley CA, US
Jason Z. Lin - Saratoga CA, US
Eliezer Rosengaus - Palo Alto CA, US
Richard M. Wallingford - San Jose CA, US
Kishore Bubna - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06F 15/00

US Classification:

702185

Abstract:

An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates image data. Process nodes are coupled to the first network, and processes the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the anomaly report. A second network receives the anomaly reports from the process nodes. A job manager is coupled to the second network, and receives the anomaly reports from the process nodes and sends information to the process nodes to coordinate the processing of the data in the process nodes.

US Patent:

7076390, Jul 11, 2006

Filed:

Oct 18, 2004

Appl. No.:

10/967397

Inventors:

Krishnamurthy Bhaskar - San Jose CA, US
Mark J. Roulo - Mountain View CA, US
John S. Taylor - San Jose CA, US
Lawrence R. Miller - Los Altos CA, US
Paul T. Russell - Scotts Valley CA, US
Jason Z. Lin - Saratoga CA, US
Eliezer Rosengaus - Palo Alto CA, US
Richard M. Wallingford - San Jose CA, US
Kishore Bubna - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06F 15/00

US Classification:

702117, 702185

Abstract:

An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node includes memory sufficient to buffer the data until it can process the data. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

US Patent:

7127550, Oct 24, 2006

Filed:

Oct 31, 2001

Appl. No.:

10/000828

Inventors:

Jason T. Lin - Santa Clara CA, US

Assignee:

SanDisk Corporation - Milpitas CA

International Classification:

G06F 13/00

US Classification:

711103, 714 72, 714718, 714719, 365104, 36518529, 3651853

Abstract:

Methods and apparatus for accessing modules on a flash memory package concurrently during testing are disclosed. According to one aspect of the present invention, a memory device for storing data includes a plurality of modules and a logic block. The plurality of modules each include a plurality of storage elements that hold the data. The logic block is arranged to enable the plurality of modules to be accessed in parallel, and is also arranged to enable the plurality of modules to be accessed serially.

US Patent:

7149642, Dec 12, 2006

Filed:

Oct 18, 2004

Appl. No.:

10/967388

Inventors:

Krishnamurthy Bhaskar - San Jose CA, US
Mark J. Roulo - Mountain View CA, US
John S. Taylor - San Jose CA, US
Lawrence R. Miller - Los Altos CA, US
Paul T. Russell - Scotts Valley CA, US
Jason Z. Lin - Saratoga CA, US
Eliezer Rosengaus - Palo Alto CA, US
Richard M. Wallingford - San Jose CA, US
Kishore Bubna - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06F 15/00

US Classification:

702117, 702122, 702185

Abstract:

An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports. A job manager is coupled to the second network, receives the reports, and sends information to the process nodes to coordinate processing of the data.

US Patent:

7181368, Feb 20, 2007

Filed:

Oct 18, 2004

Appl. No.:

10/967419

Inventors:

Krishnamurthy Bhaskar - San Jose CA, US
Mark J. Roulo - Mountain View CA, US
John S. Taylor - San Jose CA, US
Lawrence R. Miller - Los Altos CA, US
Paul T. Russell - Scotts Valley CA, US
Jason Z. Lin - Saratoga CA, US
Eliezer Rosengaus - Palo Alto CA, US
Richard M. Wallingford - San Jose CA, US
Kishore Bubna - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06F 11/30

US Classification:

702185, 702183

Abstract:

An inspection system for detecting anomalies on a substrate. The inspection system has a sensor array for generating image data. A first high speed network is coupled to the sensor array and receives and communicates the image data. An array of process nodes is coupled to the first high speed network, and receives and processes the image data to produce anomaly reports. Each process node has an interface card coupled to the first high speed network, that receives the image data from the first high speed network and formats the image data according to a high speed interface bus protocol. The interface card sets a register indicating whether a predetermined amount of image data has been stored in a memory, and the process node reads the register to determine whether the predetermined amount of image data has been stored in the memory, and initiates image processing when the register indicates that the predetermined amount of image data has been stored in the memory.

US Patent:

7218768, May 15, 2007

Filed:

Feb 13, 2003

Appl. No.:

10/366862

Inventors:

David M. W. Evans - Braddon, AU
Jason Z. Lin - Saratoga CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06K 9/00

US Classification:

382141, 382278

Abstract:

The present invention is a hybrid technique for finding defects on digitized device images using a combination of spatial domain and frequency domain techniques. The two dimensional spectra of two images are found using Fourier like transforms. Any strong harmonics in the spectra are removed, using the same spectral filter on both spectra. The images are then aligned, transformed back to the spatial domain, and subtracted. The resulting spectrally-filtered difference image is thresholded and analyzed for defects. Use of the hybrid technique of the present invention to process digitized images results in the highest-performance and most flexible defect detection system. It is the best performer on both array and random devices, and it can cope with problems such as shading variations and the dark-bright problem that no other technique can address. The hybrid technique of the present invention also uses frequency domain techniques to align the images with fewer errors than spatial domain techniques of similar or lesser complexity. Further, the relative offsets of the pairs of images are determined by frequency domain techniques—and this method may be the most accurate and the least expensive.

US Patent:

7251586, Jul 31, 2007

Filed:

Dec 21, 2005

Appl. No.:

11/314627

Inventors:

Krishnamurthy Bhaskar - San Jose CA, US
Mark J. Roulo - Mountain View CA, US
John S. Taylor - San Jose CA, US
Lawrence R. Miller - Los Altos CA, US
Paul T. Russell - Scotts Valley CA, US
Jason Z. Lin - Saratoga CA, US
Eliezer Rosengaus - Palo Alto CA, US
Richard M. Wallingford - San Jose CA, US
Kishore Bubna - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G21C 17/00
G06F 11/30
G06F 15/00

US Classification:

702185

Abstract:

An inspection system for detecting anomalies on a substrate. A first network is coupled to the sensor array and communicates image data. Process nodes are couple to the first network, and process the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the report. A second network receives the reports from the process nodes. A job manager is coupled to the second network, and receives the reports from the process nodes and sends information to the process nodes to coordinate the processing of the data in the process nodes.