Jason K Matteson

US Patent:

7675744, Mar 9, 2010

Filed:

Oct 31, 2005

Appl. No.:

11/263207

Inventors:

Yoshihiro Fujie - Kanagawa-ken, JP
Kenji Hidaka - Kanagawa-ken, JP
Shah Mohammad Rezaul Islam - Tucson AZ, US
Robert A. Kubo - Tucson AZ, US
Bret W. Lehman - Raleigh NC, US
Robert M. Lindsay - Raleigh NC, US
Gregg S. Lucas - Tucson AZ, US
Jason A. Matteson - Raleigh NC, US
Koji Nakase - Kanagawa, JP
Hirokazu Nishimura - Kanagawa-ken, JP
Kifumi Numata - Kanagawa-ken, JP
Michihiro Okamoto - Kanagawa-ken, JP
Tony C. Sass - Fuquay Varina NC, US
Kenneth R. Schneebeli - San Jose CA, US
Tohru Sumiyoshi - Kanagawa-ken, JP
Yoshihiko Terashita - Kanagawa-ken, JP

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 1/20

US Classification:

36167937, 361688, 361692, 361727

Abstract:

A data storage library includes a drive enclosure bay which can be adapted to work with multiple air-flow configuration requirements. This is accomplished by creating air-flow ports in the top and bottom of the drive enclosure bay, by forming drive tray slots and printed circuit board ports in associated drive trays, by creating frame ports and PCB notches in associated interface cards, and replacing traditional connectors with slimmer but longer connectors that provide additional standoff and improved air-flow.

US Patent:

20140009882, Jan 9, 2014

Filed:

Jul 6, 2012

Appl. No.:

13/543089

Inventors:

Aaron R. Cox - Tucson AZ, US
Vinod Kamath - Raleigh NC, US
Jason A. Matteson - Raleigh NC, US
Jason E. Minyard - Phoenix AZ, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

H05K 7/20
G06F 1/20
F28D 15/00
B23P 19/04
F28F 7/00
F28D 15/02

US Classification:

36167931, 165185, 16510421, 16510411, 29428, 361704, 361701, 361702

Abstract:

An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.