Dr. Jason Price is a board certified pediatric pulmonologist who joined Pediatric Asthma and Pulmonary Associates of New York in August 2013. Prior to that, he was a partner at a practice in Manhattan providing comprehensive pediatric pulmonary care to children with a wide range of diagnoses. He completed his pediatric residency at New York-Presbyterian Hospital Weill Cornell Medical Center
Us Patents
Apparatus For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure
Gerard S. Maloney - Milpitas CA, US Jason Price - Eugene OR, US Scott Chin - Palo Alto CA, US Jiro Kajiwara - Cupertino CA, US Malik Charif - San Jose CA, US
Assignee:
Ebara Corporation - Tokyo
International Classification:
B24B 29/00
US Classification:
451288, 451290, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
Apparatus And Method For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure
Gerard S. Maloney - Milpitas CA, US Jason Price - Eugene OR, US Scott Chin - Palo Alto CA, US Jiro Kajiwara - Cupertino CA, US Malik Charif - San Jose CA, US
Assignee:
Ebara Corporation - Tokyo
International Classification:
B24B 1/00 B24B 5/02
US Classification:
451 41, 451 63, 451288, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
Apparatus And Method For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure
Gerard S. Maloney - Milpitas CA Jason Price - Eugene OR Scott Chin - Palo Alto CA Jiro Kajiwara - Cupertino CA Malek Charif - San Jose CA
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B 100
US Classification:
451 41, 451 63, 451288, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
Claire Delmonego, Danny Spain, Jim Golden, Dennis Barfield
Googleplus
Jason Price
Work:
Ministry of Children and Youth Services - Senior Systems Programmer/Developer (2004) Ministry of Health and Long-Term Care - Information Technical Analyst (1998-2004) Ministry of Health and Long-Term Care - Junior Programmer/Analyst (1995-1998)
Education:
Ryerson University - Project Management, Loyalist College - Information Systems
Jason Price
Work:
Covideo - President (2004)
Education:
Purdue University - Computer Science
About:
He is Co-Founder and President of Covideo, a video email service for Mac and PC users that includes companion piece iPhone and Android apps. Shortly after graduating from Purdue University in 2003 wit...