Jason T Reed

US Patent:

8564129, Oct 22, 2013

Filed:

Aug 3, 2012

Appl. No.:

13/565960

Inventors:

Robert Joseph Therrien - Cary NC, US
Jason D. Reed - Chapel Hill NC, US
Jaime A. Rumsey - Holly Springs NC, US
Allen L. Gray - Holly Springs NC, US

Assignee:

Phononic Devices, Inc. - Durham NC

International Classification:

H01L 23/48
H01L 29/43

US Classification:

257741, 257743, 257744, 257748, 257467, 257E23163, 438 54, 438602, 438603

Abstract:

Embodiments of a low resistivity contact to a semiconductor structure are disclosed. In one embodiment, a semiconductor structure includes a semiconductor layer, a semiconductor contact layer having a low bandgap on a surface of the semiconductor layer, and an electrode on a surface of the semiconductor contact layer opposite the semiconductor layer. The bandgap of the semiconductor contact layer is in a range of and including 0 to 0. 2 electron-volts (eV), more preferably in a range of and including 0 to 0. 1 eV, even more preferably in a range of and including 0 to 0. 05 eV. Preferably, the semiconductor layer is p-type. In one particular embodiment, the semiconductor contact layer and the electrode form an ohmic contact to the p-type semiconductor layer and, as a result of the low bandgap of the semiconductor contact layer, the ohmic contact has a resistivity that is less than 1×10ohmscm.

US Patent:

20200111942, Apr 9, 2020

Filed:

Mar 7, 2019

Appl. No.:

16/295699

Inventors:

- Durham NC, US
Alex Guichard - Apex NC, US
Brooks Henderson - Durham NC, US
Steve Seel - Cary NC, US
Ananthakrishnan Narayanan - Durham NC, US
Pablo Cantu - Raleigh NC, US
Kevin Oswalt - Durham NC, US
Swathi Upadhayay - Durham NC, US
Rajesh Bikky - Durham NC, US
Jason Reed - Chapel Hill NC, US

International Classification:

H01L 35/32
H01L 35/34
B32B 15/04

Abstract:

Corrosion resistant thermoelectric devices and methods of manufacturing them are disclosed herein. In some embodiments, a corrosion resistant thermoelectric device includes a semiconductor layer; a corrosion resistant top metallization layer formed on a top surface of the semiconductor layer; and a corrosion resistant bottom metallization layer formed on a bottom surface of the semiconductor layer, where the bottom surface of the semiconductor layer is opposite of the top surface of the semiconductor layer. In this way, the corrosion resistance of the device is provided by the intrinsic properties of the materials used rather than provided by the packaging or a surface coating. As such, the corrosion protection can be ensured and verified by control of the materials used to construct the device. This approach is also less susceptible to damage from shipment, handling, integration, attachment, and assembly operations because the corrosion protection is intrinsic to the materials used in construction.

US Patent:

20170365767, Dec 21, 2017

Filed:

Jun 20, 2017

Appl. No.:

15/628218

Inventors:

- Durham NC, US
Devon Newman - Morrisville NC, US
Arthur Prejs - Cary NC, US
Alex R. Guichard - Apex NC, US
Jason D. Reed - Chapel Hill NC, US
Kevin Shawne Schneider - Cary NC, US
Brian Williams - Chapel Hill NC, US
Robert J. Therrien - Cary NC, US

International Classification:

H01L 35/34
H01L 35/08
H01L 35/10
H01L 35/12

Abstract:

A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.