Jason A Reese

Address:

5190 Jordantown Rd, Vinton, VA 24179

VIN:

2HJYK16437H545625

Make:

HONDA

Model:

RIDGELINE

Year:

2007

US Patent:

8603314, Dec 10, 2013

Filed:

Dec 13, 2011

Appl. No.:

13/324332

Inventors:

Gary Hamm - Billerica MA, US
Jason A. Reese - Londonderry NH, US
George R. Allardyce - Hinckley, GB

Assignee:

Rohm and Haas Electronic Materials LLC - Marlborough MA

International Classification:

C25D 5/00
C25D 7/12
C25D 3/56
C25F 3/30

US Classification:

205 91, 205157, 205161, 205205, 205674, 205238

Abstract:

Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

US Patent:

20050112369, May 26, 2005

Filed:

Sep 29, 2004

Appl. No.:

10/953825

Inventors:

Scott Ibbitson - Trappe PA, US
Joseph Montano - Marlborough MA, US
Jason Reese - Londonderry NH, US
Robert Sloan - Ambler PA, US

Assignee:

Rohm and Haas Electronic Materials, L.L.C. - Marlborough MA

International Classification:

B32B003/00

US Classification:

428344000, 428209000, 428343000

Abstract:

Methods of enhancing the adhesion between a metal surface and an organic polymeric material, such as a dielectric material, in the manufacture of printed circuit boards are provided. Such methods use an adhesion promoting composition including polymeric particles disposed between the metal surface and the organic polymeric material. Also provided are printed circuit boards having enhanced adhesion between a metal surface and an organic polymeric material.

US Patent:

20060182881, Aug 17, 2006

Filed:

Feb 15, 2006

Appl. No.:

11/354527

Inventors:

Joseph Montano - Boston MA, US
Jason Reese - Londonderry NH, US
Luke Little - Brighton MA, US

Assignee:

Rohm and Haas Electronic Materials LLC - Marlborough MA

International Classification:

B05D 5/06
B05D 1/36

US Classification:

427162000, 427402000

Abstract:

Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

US Patent:

20080053956, Mar 6, 2008

Filed:

Aug 29, 2007

Appl. No.:

11/897383

Inventors:

Luis A. Gomez - Holden MA, US
Jason A. Reese - Londonderry NH, US

Assignee:

Rohm and Haas Electronic Materials LLC - Marlborough MA

International Classification:

C03C 15/00

US Classification:

216 41

Abstract:

Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.

US Patent:

20130264214, Oct 10, 2013

Filed:

Apr 4, 2012

Appl. No.:

13/439617

Inventors:

Gary Hamm - Billerica MA, US
David L. Jacques - Northbridge MA, US
Jason A. Reese - Londonderry NH, US

Assignee:

Rohm and Haas Electronic Materials LLC - Marlborough MA

International Classification:

H01L 21/445
C25D 3/38

US Classification:

205123, 205291

Abstract:

Metal electroplating processes are used in pH sensitive applications to plate metal layers on semiconductors. The semiconductors may be used in the manufacture of photovoltaic devices and solar cells.

US Patent:

20130288476, Oct 31, 2013

Filed:

Jun 22, 2013

Appl. No.:

13/924547

Inventors:

Jason A. REESE - Londonderry NH, US
George R. ALLARDYCE - Leicestershire, GB

International Classification:

H01L 23/00

US Classification:

438654

Abstract:

Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

US Patent:

20180087173, Mar 29, 2018

Filed:

Apr 7, 2017

Appl. No.:

15/482678

Inventors:

- Marlborough MA, US
Joshua Garth ABBOTT - Westborough MA, US
Alan C. LUND - Ashland MA, US
Robert Daniel HILTY - Walpole MA, US
Shiyun RUAN - Arlington MA, US
Jason REESE - Londonderry NH, US
Lisa J. CHAN - Boston MA, US
James A. WRIGHT - Los Gatos CA, US
James A. CURRAN - Morgan Hill CA, US

International Classification:

C25D 5/18
C22C 21/00
C25D 3/44
C25D 3/04
C25D 5/48
C25D 11/04
C25D 7/00
B32B 15/01
H05K 5/04

Abstract:

Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

US Patent:

20180002786, Jan 4, 2018

Filed:

Apr 7, 2017

Appl. No.:

15/482675

Inventors:

- Marlborough MA, US
Joshua Garth ABBOTT - Westborough MA, US
Alan C. LUND - Ashland MA, US
Robert Daniel HILTY - Walpole MA, US
Shiyun RUAN - Arlington MA, US
Jason REESE - Londonderry NH, US
Lisa J. CHAN - Boston MA, US
James A. WRIGHT - Los Gatos CA, US
James A. CURRAN - Morgan Hill CA, US

International Classification:

C22C 21/00
C25D 11/04
C25D 7/00
C25D 5/48
C25D 5/18
C25D 3/54
C25D 3/44
H05K 5/04
B32B 15/01

Abstract:

Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.