Jason Adam Ross

US Patent:

7468904, Dec 23, 2008

Filed:

Feb 23, 2007

Appl. No.:

11/678097

Inventors:

David C. Lawson - Haymarket VA, US
Jason Ross - Fairfax VA, US

Assignee:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

G11C 11/00

US Classification:

365154, 365148, 365149

Abstract:

A single event upset (SEU) hardened memory cell to be utilized in static random access memories is disclosed. The SEU hardened memory cell includes a first inverter and a second inverter connected to each other in a cross-coupled manner. The SEU hardened memory cell also includes a first resistor, a second resistor and a capacitor. The first resistor is connected between an input of the first inverter and an output of the second inverter. The second resistor is connected between an input of the second inverter and an output of the first inverter. The capacitor is connected between an input of the first inverter and an input of the second inverter.

US Patent:

8189367, May 29, 2012

Filed:

Feb 8, 2008

Appl. No.:

12/028042

Inventors:

David C. Lawson - Haymarket VA, US
Jason F. Ross - Fairfax VA, US

Assignee:

BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

G11C 11/00

US Classification:

365154, 365156, 365149, 365 72, 365188

Abstract:

A single event upset (SEU) hardened memory cell to be utilized in static random access memories is disclosed. The SEU hardened memory cell includes a first transistor, a second transistor and a first resistor connected between a source of the first transistor and a drain of the second transistor. The SEU hardened memory cell also includes a third transistor, a fourth transistor and a second resistor connected between a source of the third transistor and a drain of the fourth transistor. The first resistor is also connected between a gate of the third transistor and the drain of the second transistor. The second resistor is also connected between a gate of the first transistor and the drain of the fourth transistor.

US Patent:

20130031851, Feb 7, 2013

Filed:

Apr 13, 2011

Appl. No.:

13/640425

Inventors:

Sean Carlos Verdecia - Tampa FL, US
Jason Michael Ross - Tallahassee FL, US

Assignee:

University of South Florida - Tampa FL

International Classification:

E04B 1/348
E04B 1/58
E04B 1/00
E04C 2/34

US Classification:

521261, 526501, 527941, 522201, 403170

Abstract:

In one embodiment, a modular dwelling comprises a beam connector comprising a body and multiple arms that extend out from the body, structural beams comprising outer sides that define elongated channels that extend along a length of the beams, each beam being connected to an arm of the beam connector, a locking means that secure the structural beams to their associated beam connector arms, and a structural panel that comprises multiple edges, at least one edge of the panel being received by a channel of at least one structural beam.

US Patent:

20140017872, Jan 16, 2014

Filed:

Jul 12, 2012

Appl. No.:

13/547571

Inventors:

JASON F. ROSS - HAYMARKET VA, US
CHI-HUA YANG - MANASSAS VA, US
THOMAS J. McINTYRE - NOKESVILLE VA, US

Assignee:

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. - Nashua NH

International Classification:

H01L 21/02

US Classification:

438381, 257E21011

Abstract:

A method for fabricating a metal-insulator-metal capacitor (MIMCap) is disclosed. A first metal layer is provided on top of an oxide layer. A nitride layer is then deposited on the first metal layer. The nitride layer and the first metal layer are etched to form a MIMCap metal layer. The gaps among the MIMCap metal layer are filled with a plasma oxide, and the excess plasma oxide is polished using the nitride layer a polish stop. After removing the nitride layer, a dielectric layer and a second metal layer are deposited on the MIMCap metal layer. Finally, the dielectric layer and the second metal layer are etched to form a set of MIMCap structures.

US Patent:

20200379842, Dec 3, 2020

Filed:

May 29, 2019

Appl. No.:

16/425377

Inventors:

- Nashua NH, US
Jason F. Ross - Haymarket VA, US

Assignee:

BAE SYSTEMS Information and Electronic Systems Integration Inc. - Nashua NH

International Classification:

G06F 11/10
G11C 11/56
G11C 11/16
G06F 1/3206
G06F 1/3287

Abstract:

A disclosed apparatus and method reduce the likelihood of multiple bit single event upset (SEU) errors in space-deployed memory devices and memory macros, without requiring novel, specialized memory designs and without significant added cost or performance loss. For each memory, a bit selection layer effectively increases the mux of the memory bit table, thereby reducing the word size while increasing the word capacity, without changing the total memory capacity. As a result, the separation between the physical bit storage locations for each word is increased, thereby reducing the likelihood of multiple bit SEU errors. A buffer can be implemented if the memory lacks individual bit write control. The memory can be implemented in a core IC of an MCM-HIC, and the bit selection layer and/or buffer can be implemented in a chiplet or chiplets of the MCM-HIC.

US Patent:

20200105360, Apr 2, 2020

Filed:

Sep 28, 2018

Appl. No.:

16/146650

Inventors:

- NASHUA NH, US
JASON F. ROSS - HAYMARKET VA, US
KEVIN LINGER - ARLINGTON VA, US

International Classification:

G11C 29/32
G11C 7/22
G11C 7/10

Abstract:

A scannable-latch random access memory (SLRAM) is disclosed. The SLRAM includes two rows of memory cells. The SLRAM includes a functional data input, a scan data input, a first and second functional data outputs, a scan data output, and a scan enable. The functional data input is connected to a first memory cell in a first and second rows of memory cells. The scan data input is connected to the first memory cell in the first or second row of memory cells. The first and second functional data outputs are connected to a last memory cell in the first and second row of memory cells, respectively. The scan data output is connected to the last memory cell in the first or second row of memory cells. The scan enable allows data to be output from the scan data output or the first and second functional data outputs.

US Patent:

20200051961, Feb 13, 2020

Filed:

Aug 7, 2018

Appl. No.:

16/057204

Inventors:

- Nashua NH, US
Jason F. Ross - Haymarket VA, US
John T. Matta - Nokesville VA, US
Richard J. Ferguson - Bealeton VA, US
Alan F. Dennis - Chantilly VA, US
Daniel L. Stanley - Warrenton VA, US

International Classification:

H01L 25/16
H01L 23/498
H01L 23/00
H01L 27/112
H01L 25/00

Abstract:

An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.