Jason D West

US Patent:

20230096345, Mar 30, 2023

Filed:

Sep 22, 2022

Appl. No.:

17/951075

Inventors:

- Boulder CO, US
Jason W. West - Broomfield CO, US
Daniel Katzman - Boulder CO, US
Hunter Hach - Boulder CO, US
Keller Lofgren - Boulder CO, US

International Classification:

H05K 7/20
H04B 1/3888
A45C 11/00

Abstract:

A phone case with a phone case body and a thermal ground plane is disclosed. The phone case, for example, may include fin that folds, bends, and/or extends outward from the phone case body. The phone case, for example, may include a magnetic area that comprises a toroid or donut shape. The phone case, for example, may include an aperture that extends through the phone case body and/or the thermal ground plane. The thermal ground plane may include a first casing; a liquid transport layer comprising a mesh or an array of pillars; a vapor transport layer comprising a mesh or an array of pillars; and a second casing, an outer periphery of the first casing and an outer periphery of the second casing are sealed together encasing the liquid transport layer, the vapor transport layer, and a heat transfer fluid.

US Patent:

20210400846, Dec 23, 2021

Filed:

Jun 18, 2021

Appl. No.:

17/352250

Inventors:

- Boulder CO, US
Yung-Cheng Lee - Boulder CO, US
Jason W. West - Broomfield CO, US
Kyle Wagner - Minneapolis MN, US

International Classification:

H05K 7/20

Abstract:

Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.

US Patent:

20210293488, Sep 23, 2021

Filed:

May 1, 2020

Appl. No.:

16/864236

Inventors:

- Boulder CO, US
Jason West - Boulder CO, US
Kyle Wagner - Boulder CO, US
Dylan McNally - Boulder CO, US
Keller Lofgren - Boulder CO, US

International Classification:

F28D 15/04
F28D 15/02

Abstract:

Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.