Jay D Baker

US Patent:

6338439, Jan 15, 2002

Filed:

Dec 22, 1999

Appl. No.:

09/470138

Inventors:

Lakhi Nandlal Goenka - Ann Arbor MI
Marc Alan Straub - Dearborn Heights MI
Jay D Baker - Dearborn MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

B05B 1700

US Classification:

239 8, 239418, 239419, 239422, 239423, 2394245, 239428, 239429, 239430

Abstract:

A nozzle assembly including a first inlet aperture which receives material which is to be selectively emitted from assembly. Assembly includes an outlet aperture having several apertures , and which are respectively separated by substantially identical elements , and. Elements cooperatively form a plurality of passages or channels through assembly. A centrally disposed channel is relatively narrower than the other channels , and , and channels are relatively narrower than outermost channels , thereby causing material to be emitted at a substantially similar and/or uniform velocity at each point or location within outlet aperture.

US Patent:

6357669, Mar 19, 2002

Filed:

Dec 22, 1999

Appl. No.:

09/470139

Inventors:

Lakhi Nandlal Goenka - Ann Arbor MI
Marc Alan Straub - Dearborn Heights MI
Jay D Baker - Dearborn MI

Assignee:

Visteon Global tech., Inc. - Dearborn MI

International Classification:

B05B 706

US Classification:

239 8, 239290, 239294, 239308, 239346, 239340, 239369, 239370, 239418, 239427, 2394273, 239429, 239432

Abstract:

A nozzle which receives first and second materials and which has an outlet aperture The first material is received within the outlet aperture and is atomized by the second material within the outlet aperture before it is emitted from the nozzle and applied to a targeted location and/or object.

US Patent:

6408811, Jun 25, 2002

Filed:

Apr 18, 2000

Appl. No.:

09/551371

Inventors:

Andrew Zachary Glovatsky - Plymouth MI
Jay DeAvis Baker - Dearborn MI
Myron Lemecha - Dearborn Heights MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

F02P 2300

US Classification:

12318461

Abstract:

Conductors supported integrally with engine structure such as air intake manifolds and the like provide interconnection between engine components without the need for separate conventional wiring harnesses. The conductors take their mechanical strength from the underlying physical object and thus can be lighter than a freestanding harness. Connectors allow traces to continue across points of mechanical interface between structural components and allow wiring of engine components to be accomplished in the same operation as their physical assembly.

US Patent:

6412168, Jul 2, 2002

Filed:

Sep 6, 2000

Appl. No.:

09/655750

Inventors:

Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI

Assignee:

Visteon Global Tech, Inc. - Dearborn MI

International Classification:

H01K 310

US Classification:

29852, 29830, 29846, 29851

Abstract:

A multi-layer electronic circuit board design having selectively formed apertures or cavities.

US Patent:

6454878, Sep 24, 2002

Filed:

Nov 1, 2000

Appl. No.:

09/703553

Inventors:

Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Jay D Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

C23C 806

US Classification:

148284, 216 13, 216 20, 29830

Abstract:

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

US Patent:

6501031, Dec 31, 2002

Filed:

Sep 6, 2000

Appl. No.:

09/655809

Inventors:

Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI
Robert Edward Belke - West Bloomfield MI
Myron Lemecha - Dearborn Heights MI
Richard Keith McMillan - Dearborn MI
Thomas B. Krautheim - Belleville MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

H05K 111

US Classification:

174262, 29846, 29832, 29852, 29856

Abstract:

A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed âblindâ apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member.

US Patent:

6528736, Mar 4, 2003

Filed:

Jan 21, 1997

Appl. No.:

08/786494

Inventors:

Daniel Phillip Dailey - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Achyuta Achari - Canton MI
Myron Lemecha - Dearborn MI
Michael George Todd - South Lyon MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01R 909

US Classification:

174261, 174255, 361772, 361809

Abstract:

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

US Patent:

6547117, Apr 15, 2003

Filed:

Jul 12, 2001

Appl. No.:

09/904346

Inventors:

Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Joseph Mario Giachino - Farmington Hills MI
Lakhi Nandlal Goenka - Ann Arbor MI
Myron Lemecha - Dearborn MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

B60R 700

US Classification:

224539, 224926

Abstract:

A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.