Jean K Vangsness

US Patent:

6656018, Dec 2, 2003

Filed:

Apr 10, 2000

Appl. No.:

09/545982

Inventors:

Oscar K. Hsu - Chelmsford MA
Jean K. Vangsness - Stow MA
Scott C. Billings - Kingston NH
David S. Gilbride - Lowell MA

Assignee:

Freudenberg Nonwovens Limited Partnership - Durham NC

International Classification:

B24B 100

US Classification:

451 41, 451 42, 451285, 51294

Abstract:

A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.

US Patent:

6712681, Mar 30, 2004

Filed:

Nov 20, 2000

Appl. No.:

09/715184

Inventors:

Kenneth P. Rodbell - Sandy Hook CT
Oscar Kai Chi Hsu - Chelmsford MA
Jean Vangsness - Stow MA
David S. Gilbride - Lowell MA
Scott Clayton Billings - Kingston NH
Kenneth Davis - Newburgh NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24D 1100

US Classification:

451532, 451536

Abstract:

A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.

US Patent:

6890244, May 10, 2005

Filed:

Sep 18, 2003

Appl. No.:

10/664735

Inventors:

Oscar K. Hsu - Chelmsford MA, US
Jean K. Vangsness - Stow MA, US
Scott C. Billings - Kingston NH, US
David S. Gilbride - Lowell MA, US

Assignee:

Freudenberg Nonwovens Limited Partnership - Durham NC

International Classification:

B24B007/19

US Classification:

451 41, 451 42, 451287, 451296, 51294, 51389

Abstract:

A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.

US Patent:

6964604, Nov 15, 2005

Filed:

Apr 5, 2004

Appl. No.:

10/816882

Inventors:

Kenneth Davis - Newburgh NY, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US

Assignee:

International Business Machines Corporation - Armonk NY
Freudenberg Nonwovens Ltd. - Lowell MA

International Classification:

B24D011/00

US Classification:

451532, 451527, 451 41

Abstract:

A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.

US Patent:

6989117, Jan 24, 2006

Filed:

Feb 23, 2004

Appl. No.:

10/782922

Inventors:

Kenneth P. Rodbell - Sandy Hook CT, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Jean Vangsness - Stow MA, US
David S. Gilbride - Lowell MA, US
Scott Clayton Billings - Kingston NH, US
Kenneth Davis - Newburgh NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B29C 39/42

US Classification:

264102, 264139, 264255, 264257, 264258, 264324, 156245

Abstract:

A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.

US Patent:

7086932, Aug 8, 2006

Filed:

May 11, 2004

Appl. No.:

10/843111

Inventors:

Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US

Assignee:

Freudenberg Nonwovens - Lowell MA

International Classification:

B24B 1/00

US Classification:

451 28, 451532

Abstract:

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

US Patent:

7186166, Mar 6, 2007

Filed:

Nov 14, 2005

Appl. No.:

11/271744

Inventors:

Kenneth Davis - Newburgh NY, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US

Assignee:

International Business Machines Corporation - Armonk NY
Freudenberg Nonwovens Ltd. - Lowell MA

International Classification:

B24B 1/00

US Classification:

451 28, 451532

Abstract:

A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.

US Patent:

7357704, Apr 15, 2008

Filed:

Jun 15, 2006

Appl. No.:

11/424466

Inventors:

Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US

Assignee:

innoPad, Inc. - Peabody MA

International Classification:

B24D 11/00

US Classification:

451532, 451 28

Abstract:

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.