Jeff Busby Latham

US Patent:

63007789, Oct 9, 2001

Filed:

Sep 8, 1999

Appl. No.:

9/392084

Inventors:

Michael D. Frederickson - Indianapolis IN
Martin A. Seitz - Brookfield WI
Richard W. Hirthe - Milwaukee WI
Mohammad N. Amin - Milwaukee WI
Anthony L. Delieto - Camby IN
Alex E. Cragoe - Indianapolis IN
Jeff K. Latham - New Castle IN
Patrick D. Riggs - Greenwood IN

Assignee:

The United States of America as represented by the Secretary of the Navy - Washington DC

International Classification:

G01R 2708

US Classification:

324693

Abstract:

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, non-linear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

US Patent:

56569335, Aug 12, 1997

Filed:

Feb 24, 1995

Appl. No.:

8/393765

Inventors:

Michael D. Frederickson - Indianapolis IN
Martin A. Seitz - Brookfield WI
Richard W. Hirthe - Milwaukee WI
Mohammad N. Amin - Milwaukee WI
Anthony L. DeLieto - Camby IN
Alex E. Cragoe - Indianapolis IN
Jeff K. Latham - New Castle IN
Patrick D. Riggs - Greenwood IN

Assignee:

The United States of America as represented by the Secretary of the Navy - Washington DC

International Classification:

G01R 2708

US Classification:

324693

Abstract:

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, nonlinear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

US Patent:

60053992, Dec 21, 1999

Filed:

Jun 12, 1997

Appl. No.:

8/874056

Inventors:

Michael D. Frederickson - Indianapolis IN
Martin A. Seitz - Brookfield WI
Richard W. Hirthe - Milwaukee WI
Mohammad N. Amin - Milwaukee WI
Anthony L. Delieto - Camby IN
Alex E. Cragoe - Indianapolis IN
Jeff K. Latham - New Castle IN
Patrick D. Riggs - Greenwood IN

Assignee:

The United States of America as represented by the Secretary of the Navy - Washington DC

International Classification:

G01R 2708

US Classification:

324693

Abstract:

This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardwa software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, non-linear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and to statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

US Patent:

62632949, Jul 17, 2001

Filed:

Mar 2, 1998

Appl. No.:

9/033522

Inventors:

Michael D. Frederickson - Indianapolis IN
Jeff K. Latham - New Castle IN
Alex E. Cragoe - Indianapolis IN

Assignee:

American Competitiveness Institute, Inc. - Plymouth Meeting PA

International Classification:

G01R 2708

US Classification:

702117

Abstract:

An impedance spectroscopy system characterizes the rheologic and thixotropic properties of solder paste and residues by measuring its impedance at various frequencies. The impedance spectroscopy system provides voltage and current inputs to a sample at various frequencies and measures the resulting impedance. The impedance spectroscopy system stores equivalent circuit parameters for multiple solder pastes and residues, controls the voltage and current inputs to the sample, displays measurement data in real-time, displays results, and notifies the operator if results exceed preset limits.