Jeff Lin

US Patent:

6398580, Jun 4, 2002

Filed:

Jan 11, 2000

Appl. No.:

09/481821

Inventors:

Jeff C. Lin - Novi MI
Paul Jerome Brzyski - Rochester MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

H01R 424

US Classification:

439402

Abstract:

A terminal member having a body and outwardly protruding blades The body and blades include respective insulation displacement apertures which selectively allow high powered electrical signals to be received by the terminal member and which further allow the selective creation of many diverse types of electrical circuits.

US Patent:

6423141, Jul 23, 2002

Filed:

Jul 22, 1999

Appl. No.:

09/358980

Inventors:

Jeff Lin - Canton MI
John Trublowski - Troy MI
Vinh Van Ha - Southfield MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

B05C 302

US Classification:

118413

Abstract:

A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression head cap further includes a plurality of members which are selectively and movably disposed within the contained environment and which selectively remove an amount of the material from the environment, effective to prevent the material from being undesirably dispensed by the head cap.

US Patent:

6761926, Jul 13, 2004

Filed:

Sep 19, 1996

Appl. No.:

08/716037

Inventors:

Vinh Van Ha - Southfield MI
Jeff J. Lin - Canton MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

B05D 132

US Classification:

427 96, 427282

Abstract:

A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil.

US Patent:

7510400, Mar 31, 2009

Filed:

Mar 14, 2007

Appl. No.:

11/686101

Inventors:

Andrew Z. Glovatsky - Plymouth MI, US
Jeff C. Lin - Novi MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H01R 12/00

US Classification:

439 56, 4396992, 362800

Abstract:

An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

US Patent:

7618160, Nov 17, 2009

Filed:

May 23, 2007

Appl. No.:

11/752801

Inventors:

Jeyachandrabose Chinniah - Belleville MI, US
Jeff C. Lin - Novi MI, US
Christopher L. Eichelberger - Livonia MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

F21V 5/00
G02B 3/02
G02B 17/00

US Classification:

362326, 362335, 359708, 359726, 359737

Abstract:

A lens for use with a light emitting source is provided. The lens has a main body with a light-collecting face and a light-emitting face and which defines an optical axis extending through the centers of these two faces. A pocket for receiving light from the light source is defined in the light-collecting face by an inner axially-facing surface surrounded by an inner radially-facing surface. The inner axially-facing surface is concave and has a spherical shape. The inner radially-facing surface has a non-spherical, tapered shape and extends between the axially-facing surface and an open end of the pocket. A light assembly incorporating the lens includes a light-emitting diode.

US Patent:

7621752, Nov 24, 2009

Filed:

Jul 17, 2007

Appl. No.:

11/778945

Inventors:

Jeff C. Lin - Novi MI, US
Viren B. Merchant - Canton MI, US
Edwin Mitchell Sayers - Saline MI, US
Andrew Z. Glovatsky - Plymouth MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H01R 12/00

US Classification:

439 56, 4396992

Abstract:

Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

US Patent:

20080310028, Dec 18, 2008

Filed:

Jun 18, 2007

Appl. No.:

11/764779

Inventors:

Jeyachandrabose Chinniah - Belleville MI, US
Edwin Mitchell Sayers - Saline MI, US
Jeff C. Lin - Novi MI, US
Christopher L. Eichelberger - Livonia MI, US

International Classification:

G02B 17/00

US Classification:

359642

Abstract:

The present invention provides a near field lens for an automotive light assembly. The lens comprises a main body having a radial collimating portion formed as a rotation about a central axis. A light-collecting faces defines pocket in the main body and receives light from the light source. The radial collimating portion is structured to radially direct light in planes normal to the central axis and to collimate light in radial planes through the central axis. By extending the main body, a thin plate near field lens is provided.

US Patent:

20090104804, Apr 23, 2009

Filed:

Oct 23, 2007

Appl. No.:

11/876838

Inventors:

Jeff Lin - Novi MI, US

International Classification:

H01R 4/58
H05K 3/10

US Classification:

439211, 29846

Abstract:

An LED interconnection apparatus and a method of electrical connection for an array of LEDs are disclosed, the LED interconnection apparatus including a back plate substrate having a plurality of adaptable through-holes formed therein and a flexible conductive pattern disposed adjacent the back plate substrate, wherein the adaptable through-holes of the back plate substrate facilitate selective access to the flexible conductive pattern to provide a simple, adaptable, and standardized method of electrical communication for an array of LEDs.