Jeffrey T Carr

US Patent:

6607923, Aug 19, 2003

Filed:

Mar 4, 1998

Appl. No.:

09/034457

Inventors:

Jeffrey William Carr - Morgan Hill CA
Moris Musa Dovek - San Carlos CA
Mohamad Towfik Krounbi - San Jose CA

Assignee:

Hitachi Global Technologies - Amsterdam

International Classification:

H01L 2100

US Classification:

438 3, 438128, 438131

Abstract:

A magnetoresistive read/inductive write magnetic head assembly formed on a hard electrically insulating substrate and having electrostatic discharge protection comprises: a hard electrically insulating substrate, preferably formed of sapphire or alumina-TiC; multiple alumina layers formed over the substrate; a magnetoresistive read/inductive write head positioned between the alumina layers; a silicon layer supported by the substrate; and a semiconducting circuit integrated into the silicon layer and interconnected with said magnetoresistive read/write inductive write head to provide electrostatic discharge protection to the head. The silicon layer may be epitaxially grown on the substrate when implemented as sapphire, or bonded to the substrate when implemented as alumina-TiC. The hard electrically insulating substrate and alumina layers provide the assembly with a hard air bearing surface having generally uniform lapping and etching characteristics, and excellent durability.

US Patent:

6660177, Dec 9, 2003

Filed:

Nov 7, 2001

Appl. No.:

10/008236

Inventors:

Jeffrey W. Carr - Livermore CA

Assignee:

Rapt Industries Inc. - Livermore CA

International Classification:

H01L 2100

US Classification:

216 63, 15634526, 15634555, 216 38, 216 67, 216 79, 216 80, 216 37

Abstract:

Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece.

US Patent:

7297892, Nov 20, 2007

Filed:

Aug 6, 2004

Appl. No.:

10/913739

Inventors:

Jude Kelley - Belmont CA, US
Jeffrey W. Carr - Livermore CA, US
Peter S. Fiske - Oakland CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B23K 9/00
B23K 9/02

US Classification:

21912142, 21912136, 21912147

Abstract:

A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

7311851, Dec 25, 2007

Filed:

Jun 27, 2003

Appl. No.:

10/608384

Inventors:

Jeffrey W. Carr - Livermore CA, US

Assignee:

Rapt Industries, Inc. - Fremont CA

International Classification:

B44C 1/22

US Classification:

216 63, 216 58, 216 67, 438706, 438710

Abstract:

Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

7371992, May 13, 2008

Filed:

Mar 7, 2003

Appl. No.:

10/384506

Inventors:

Jeffrey W. Carr - Livermore CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B23K 10/06

US Classification:

21912144, 21912159, 2191214

Abstract:

A flame torch can be used to clean the surface of a contact-sensitive object, such as a glass optic, extremely thin workpiece, or semiconductor wafer by providing a reactive precursor gas to the feed gases of the torch. Reactive atom plasma processing can be used to clean the surface of a contaminant that chemically combines with the atomic radicals of the precursor without affecting the surface. The torch can also be used to modify the surface after cleaning, without transferring the object or engaging in any intermediate processing, by supplying a second reactive precursor that reacts with the surface itself. The flame torch can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the object. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

7510664, Mar 31, 2009

Filed:

Nov 1, 2001

Appl. No.:

10/002035

Inventors:

Jeffrey W. Carr - Livermore CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B29D 11/00
C23F 1/00

US Classification:

216 24, 216 38, 216 68, 216 80

Abstract:

Fabrication apparatus and methods are disclosed for shaping and finishing difficult materials with no subsurface damage. The apparatus and methods use an atmospheric pressure mixed gas plasma discharge as a sub-aperture polisher of, for example, fused silica and single crystal silicon, silicon carbide and other materials. In one example, workpiece material is removed at the atomic level through reaction with fluorine atoms. In this example, these reactive species are produced by a noble gas plasma from trace constituent fluorocarbons or other fluorine containing gases added to the host argon matrix. The products of the reaction are gas phase compounds that flow from the surface of the workpiece, exposing fresh material to the etchant without condensation and redeposition on the newly created surface. The discharge provides a stable and predictable distribution of reactive species permitting the generation of a predetermined surface by translating the plasma across the workpiece along a calculated path.

US Patent:

7591957, Sep 22, 2009

Filed:

Nov 1, 2001

Appl. No.:

10/002483

Inventors:

Jeffrey W. Carr - Livermore CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B23K 9/00
H05B 1/00
H05B 11/00

US Classification:

216 24, 216 68, 219209, 21912136, 21912137

Abstract:

Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.

US Patent:

7955513, Jun 7, 2011

Filed:

Dec 20, 2007

Appl. No.:

11/962012

Inventors:

Jeffrey W. Carr - Livermore CA, US

Assignee:

Rapt Industries, Inc. - Fremont CA

International Classification:

B44C 1/22

US Classification:

216 63, 216 58, 216 67, 438708, 438710

Abstract:

A method for shaping a surface of a workpiece, comprises positioning at least one of a workpiece and an inductively-coupled plasma (ICP) torch including three concentrically arranged tubes. A plasma gas is introduced to an outer tube of the ICP torch and energy is transferred from a radio frequency (RF) power source to the plasma gas to generate an excitation zone at least partially downstream of the ICP torch. A reactive reactive precursor is introduced to the excitation zone, and an auxiliary gas is introduced to the intermediate tube to control a position of the excitation zone relative to the ICP torch so that a controlled distribution of reactive species is formed. The surface is shaped by removing material from the surface of the workpiece with at least a portion of the reactive species and adding material to the surface of the workpiece with at least a portion of the reactive species.