Jeffrey Wayne Carr

US Patent:

7297892, Nov 20, 2007

Filed:

Aug 6, 2004

Appl. No.:

10/913739

Inventors:

Jude Kelley - Belmont CA, US
Jeffrey W. Carr - Livermore CA, US
Peter S. Fiske - Oakland CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B23K 9/00
B23K 9/02

US Classification:

21912142, 21912136, 21912147

Abstract:

A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

7304263, Dec 4, 2007

Filed:

Aug 5, 2004

Appl. No.:

10/911821

Inventors:

Andrew Chang - Oakland CA, US
Jeffrey W. Carr - Livermore CA, US
Jude Kelley - Belmont CA, US
Peter S. Fiske - Oakland CA, US

Assignee:

RAPT Industries, Inc. - Fremont CA

International Classification:

B23K 9/00

US Classification:

21912141, 21912148, 21912159, 15634539, 264 136, 216 38

Abstract:

The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

20050061774, Mar 24, 2005

Filed:

Aug 6, 2004

Appl. No.:

10/913808

Inventors:

Jude Kelley - Belmont CA, US
Jeffrey Carr - Livermore CA, US
Peter Fiske - Oakland CA, US
Andrew Chang - Oakland CA, US

Assignee:

RAPT Industries, Inc. - Livermore CA

International Classification:

C03C015/02
C23F001/12

US Classification:

216067000, 216059000, 216074000, 065029120, 065102000, 065111000

Abstract:

High-quality glass parts, such as high-end optics, can be generated using a completely damage free process. An intial damage-free forming step, such as sluping, can be used to roughly shape a glass workpiece without imparting any subsurface damage. A reactive atom processing (RAP) process can then be used to rapidly remove any anomalies or imperfections from the surface of the optic without imparting any damage unto the optic. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

US Patent:

20080029485, Feb 7, 2008

Filed:

Oct 15, 2007

Appl. No.:

11/872646

Inventors:

Jude Kelley - Belmont CA, US
Jeffrey Carr - Livermore CA, US
Peter Fiske - Oakland CA, US

Assignee:

RAPT INDUSTRIES, INC. - Fremont CA

International Classification:

B44C 1/22

US Classification:

216067000

Abstract:

A tool for modifying a surface of a workpiece comprises a heat source having a modifiable footprint for heating a selectable portion of the surface, a reactive atom plasma torch, and a reactive precursor receivable within a plasma of the reactive atom plasma torch. The reactive cursor is received by the plasma to form a reactive species that chemically combines with a portion of the surface heated by the footprint of the heat source to produce a gas and leave the surface.

US Patent:

20080035612, Feb 14, 2008

Filed:

Oct 19, 2007

Appl. No.:

11/875787

Inventors:

Andrew Chang - Oakland CA, US
Jeffrey Carr - Livermore CA, US
Jude Kelley - Belmont CA, US
Peter Fiske - Oakland CA, US

Assignee:

RAPT INDUSTRIES, INC. - Fremont CA

International Classification:

B23K 10/00

US Classification:

219121440

Abstract:

A method for reducing heat applied to a workpiece by a plasma discharge of a reactive plasma torch comprises determining a footprint of the plasma discharge on a surface of the workpiece based on a distance of the reactive atom plasma torch from the surface, determining a maximum heat absorbable by the workpiece, and determining an adjusted footprint of the reactive atom plasma torch on the surface based on the maximum heat absorbable by the workpiece. An aperture of an aperture device is selected based on the adjusted footprint of the reactive atom plasma torch. The aperture device is then positioned so that a portion of the plasma is one or both of deflected and absorbed by the aperture device, thereby reducing the heat absorbed by the workpiece.

US Patent:

20220357967, Nov 10, 2022

Filed:

Jul 21, 2022

Appl. No.:

17/870387

Inventors:

- Mountain View CA, US
Jeffrey Carr - San Francisco CA, US
Paul Lappas - San Francisco CA, US

International Classification:

G06F 9/455
G06F 8/61

Abstract:

Some embodiments provide a method for extracting and adapting system configuration. The method extracts a first configuration from a first node of a first hosting system. The first node includes several resources for hosting the first configuration. The method analyzes the first configuration in order to determine attributes of the first configuration. The determined attributes are relevant to hosting the first configuration on a second node of a second hosting system having several nodes. The method generates a second configuration based on the determined attributes. The method hosts the second configuration at the second node of the second hosting system.