Jeffrey S Jensen

US Patent:

7448653, Nov 11, 2008

Filed:

Jun 10, 2005

Appl. No.:

11/149624

Inventors:

Jeffrey P. Jensen - Fort Collins CO, US
Ralph E. Burns - Louisville CO, US
Raymond Townsend - Johnstown CO, US
Richard W. Cairns - Longmont CO, US

Assignee:

Value Plastics, Inc. - Fort Collins CO

International Classification:

F16L 37/00

US Classification:

285307, 285305, 285308, 604533

Abstract:

A female connector for releasable coupling with a male connector is disclosed herein. The male connector defines a fluid conduit and includes a male end adapted to be received within the female connector. The male end includes a coupling feature. The female connector comprises an opening, a collet finger, and an actuation element. The opening is adapted to guide the male connector along a first line of action as the male connector passes into the opening to be received within the female connector. The collet finger includes an engagement feature adapted to engage the coupling feature of the male end and displace along a second line of action generally normal to the first line of action. The actuation element is adapted to displace along a third line of action generally normal to the first and second lines of action in order to disengage the engagement feature from the coupling feature of the male end. When the engagement feature is engaged with the coupling feature, the fluid conduit of the male connector is held in fluid communication with a fluid conduit of the female connector.

US Patent:

7770939, Aug 10, 2010

Filed:

Jul 23, 2008

Appl. No.:

12/178138

Inventors:

Jeffrey P. Jensen - Fort Collins CO, US
Ralph E. Burns - Louisville CO, US
Raymond Townsend - Johnstown CO, US
Richard W. Cairns - Longmont CO, US

Assignee:

Value Plastics, Inc. - Fort Collins CO

International Classification:

F16L 37/00

US Classification:

285307, 285305, 285308, 604533

Abstract:

A fluid connector system may include a female connector for releasable coupling with a male connector. The male connector defines a fluid conduit and includes a male end adapted to be received within the female connector. The male end includes a coupling feature. The female connector comprises an opening, a collet finger, and an actuation element. The opening is adapted to guide the male connector along a first line of action as the male connector passes into the opening to be received within the female connector. The collet finger includes an engagement feature adapted to engage the coupling feature of the male end and displace along a second line of action generally normal to the first line of action. The actuation element is adapted to displace along a third line of action generally normal to the first and second lines of action in order to disengage the engagement feature from the coupling feature of the male end. When the engagement feature is engaged with the coupling feature, the fluid conduit of the male connector is held in fluid communication with a fluid conduit of the female connector.

US Patent:

8113546, Feb 14, 2012

Filed:

Aug 9, 2010

Appl. No.:

12/853063

Inventors:

Jeffrey P. Jensen - Fort Collins CO, US
Ralph E. Burns - Louisville CO, US
Raymond Townsend - Johnstown CO, US
Richard W. Cairns - Longmont CO, US

Assignee:

Value Plastics, Inc. - Fort Collins CO

International Classification:

F16L 37/00

US Classification:

285307, 285305, 285308, 604533

Abstract:

A latching female tubing coupler comprises an opening, a collet finger, and an actuation member. The opening is adapted to guide a male connector along a first line of action as the male connector passes into the opening to be received within the latching female tubing coupler. The collet finger includes an engagement feature adapted to engage a coupling feature of the male connector and displace along a second line of action generally normal to the first line of action. The actuator member is adapted to displace along a third line of action generally normal to the first and second lines of action in order to disengage the engagement feature from the coupling feature of the male connector. When the engagement feature is engaged with the coupling feature on a male connector, a fluid conduit of the male connector is held in fluid communication with a fluid conduit of the latching female tubing coupler.

US Patent:

20110288458, Nov 24, 2011

Filed:

Apr 15, 2011

Appl. No.:

13/088101

Inventors:

James W. Jones - Longmont CO, US
Jeffrey L. Jensen - Evergreen CO, US
Thomas E. Gage - Longmont CO, US
John V. Atanasoff - Boulder CO, US

Assignee:

MEDEFFICIENCY, INC. - Wheat Ridge CO

International Classification:

A61H 7/00

US Classification:

601149

Abstract:

Embodiments of the present invention relate to medical devices and treatments for chronic venous insufficiency, open ulceration and related medical conditions, and more particularly to a device and treatment incorporating negative pressure compression to the foot and lower leg or other appendage of a patient.

US Patent:

20130018294, Jan 17, 2013

Filed:

Jan 18, 2012

Appl. No.:

13/353163

Inventors:

James W. JONES - Longmont CO, US
Nathan J. JONES - Loveland CO, US
Jodie L. CURRIE - Golden CO, US
Jeffrey L. JENSEN - Evergreen CO, US

International Classification:

A61F 5/00

US Classification:

602 27

Abstract:

An orthotic device according to embodiments of the present invention includes a substantially rigid internal footbed with an external rocker bottom, two struts rigidly coupled to the footbed, a paddle coupled to each strut, each paddle having an inner surface configured to face a limb of a patient, and a strap system configured to interface with the paddles for tightening around the limb, the inner surfaces of the paddles including a plurality of protrusions configured to minimize sliding of the first and second paddles with respect to the limb or with respect to a cast applied to the limb. The orthotic device may include two or more support layers on the footbed, each layer having a support aperture larger than and at least partially overlapping the support aperture below.

US Patent:

20130180104, Jul 18, 2013

Filed:

Jan 18, 2012

Appl. No.:

13/353012

Inventors:

WAYNE L. MOUL - Loveland CO, US
SCOTT E.M. FRUSHOUR - Boulder CO, US
JEFFREY L. JENSEN - Boulder CO, US

Assignee:

TYCO Healthcare Group LP - Mansfield MA

International Classification:

H05K 3/10

US Classification:

29846

Abstract:

A method of manufacturing a printed circuit board includes the initial steps of providing a first layer stack and providing a second layer stack. The first layer stack includes a first electrically-insulating layer. The first electrically-insulating layer includes a first surface and one or more electrically-conductive traces disposed on the first surface. The second layer stack includes a second electrically-insulating layer and a first electrically-conductive layer. The second electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the second electrically-insulating layer. The second layer stack further includes a cut-out area defining a void that extends therethrough. The cut-out area is configured to receive therein at least a portion of a device to be coupled to the first surface of the first electrically-insulating layer and electrically-coupled to one or more of the one or more electrically-conductive traces.

US Patent:

20130180105, Jul 18, 2013

Filed:

Jan 18, 2012

Appl. No.:

13/353019

Inventors:

Wayne L. Moul - Loveland CO, US
Scott E. M. Frushour - Boulder CO, US
Jeffrey L. Jensen - Boulder CO, US

Assignee:

TYCO Healthcare Group LP - Mansfield MA

International Classification:

H05K 3/10

US Classification:

29846

Abstract:

A method of manufacturing a printed circuit board includes the steps of providing a first layer stack including a first electrically-conductive layer and a first electrically-insulating layer and providing a second layer stack including a second electrically-insulating layer. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second electrically-insulating layer includes one or more electrically-conductive traces disposed on a first surface thereof. The method also includes mounting a device on the first surface of the second electrically-insulating layer such that the device is electrically-coupled to at least one of the one or more electrically-conductive traces, and providing the first layer stack with a cut-out area defining a void that extends from the second surface of the first electrically-insulating layer to the first surface of the first electrically-conductive layer. The cut-out area is configured to receive at least a portion of the device therein.

US Patent:

20130180762, Jul 18, 2013

Filed:

Jan 18, 2012

Appl. No.:

13/352909

Inventors:

Wayne L. Moul - Loveland CO, US
Scott E.M. Frushour - Boulder CO, US
Jeffrey L. Jensen - Boulder CO, US

Assignee:

TYCO Healthcare Group LP - Mansfield MA

International Classification:

H05K 1/16
H05K 3/00

US Classification:

174251, 29829

Abstract:

A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers.