Jeffrey C Lowe

US Patent:

7163896, Jan 16, 2007

Filed:

Dec 10, 2003

Appl. No.:

10/733858

Inventors:

Wenxian Zhu - Palo Alto CA, US
Jengyi Yu - San Jose CA, US
Siswanto Sutanto - San Jose CA, US
Pingsheng Sun - San Jose CA, US
Jeffrey Chih-Hou Lowe - Milpitas CA, US
Waikit Fung - Cupertino CA, US
Tze Wing Poon - Sunnyvale CA, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

H01L 21/311

US Classification:

438694, 257E21218

Abstract:

Biased plasma etch processes incorporating Hetch chemistries. In particular, high density plasma chemical vapor etch-enhanced (deposition-etch-deposition) gap fill processes incorporating etch chemistries which incorporate hydrogen as the etchant that can effectively fill high aspect ratio gaps while reducing or eliminating dielectric contamination by etchant chemical species.

US Patent:

20130115779, May 9, 2013

Filed:

Oct 26, 2012

Appl. No.:

13/662078

Inventors:

Jeffrey Chih-Hou Lowe - Cupertino CA, US
Sandeep Mariserla - Danbury CT, US
Robert Anthony Sculac - Lake Oswego OR, US

Assignee:

INTERMOLECULAR, INC. - San Jose CA

International Classification:

H01L 21/306
H01L 21/308

US Classification:

438706, 438745, 1563453, 15634519, 257E21219

Abstract:

In some embodiments, the present invention discloses sealing mechanisms for generating site isolated regions on a substrate, allowing combinatorial processing without cross contamination between regions. The sealing mechanism can include a thin sharp edge ring for pressing on the substrate surface with small contact area. The small sealing area can concentrate the sealing force, generating higher contact pressure to guard against fluid leakage across the sealing surface, for example, eliminating fluid wicking at the seal interface through capillary action. The sealing mechanism can include multiple protrusions, which contacts the substrate leaving a small gap at the remaining portion of the sealing mechanism. The sealing mechanism can include minimal contact points with the substrate, which can significantly reduce the particle generation during processing. A pressure differential can be established across the sealing surface to prevent fluid leakage.

US Patent:

20130145816, Jun 13, 2013

Filed:

Dec 13, 2011

Appl. No.:

13/324558

Inventors:

Jeffrey Chih-Hou Lowe - Cupertino CA, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

G01F 25/00

US Classification:

73 116

Abstract:

A method of calibrating a flow meter is provided. The method initiates with identifying a calibration fluid for a processing fluid. The calibration fluid has physical properties in common with the processing fluid with the exception of an outgassing characteristic. The method includes adding the calibration fluid to a vessel, where the vessel is in fluid communication with the flow meter and a withdrawal unit. The vessel is pressurized and the calibration fluid is withdrawn from the vessel through the flow meter and into the withdrawal unit, where the withdrawing performed by the withdrawal unit. A withdrawal volume per unit time measured by the flow meter is compared to a withdrawal volume per unit time controlled and set through the withdrawal unit.

US Patent:

20130149077, Jun 13, 2013

Filed:

Dec 13, 2011

Appl. No.:

13/324732

Inventors:

Jeffrey Chih-Hou Lowe - Cupertino CA, US
Sandeep Mariserla - Danbury CT, US
Robert Sculac - Lake Oswego OR, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

B65G 43/00

US Classification:

41422201, 414806

Abstract:

A method for combinatorially processing a substrate is provided. The method includes providing a substrate disposed on a substrate support. The substrate and the substrate support are raised against a plurality of sealing surfaces of corresponding sleeves of a plurality of flow cells of a combinatorial processing chamber. The combinatorial processing chamber is operable to concurrently process different regions of the substrate differently. A sealing pressure between the sealing surface of the sleeves and a surface of the substrate is monitored and the raising is terminated when a desired pressure is obtained. The different regions of the substrate are then processed differently.

US Patent:

20130162995, Jun 27, 2013

Filed:

Dec 27, 2011

Appl. No.:

13/337824

Inventors:

Shuogang Huang - San Jose CA, US
Chi-I Lang - Cupertino CA, US
Jeffrey Chih-Hou Lowe - Cupertino CA, US
Wen-Guang Yu - Zhubei City, TW

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

G01B 11/06
G01J 4/00

US Classification:

356369

Abstract:

A method of measuring the thickness of a one or more layers using ellipsometry is presented which overcomes problems with fitting a model to data collected in the presence of a top surface having a surface roughness (peak-to-trough) greater than about 100 Å. Prior to measurement, the top layer is pretreated to form an oxide layer of thickness between about 15 Å and about 30 Å. Ellipsometry data as a function of wavelength is then collected, and the ellipsometry data is fitted to a model including the oxide layer. For layers of doped polycrystalline silicon layers with a rough surface, the model comprises a layer consisting of a mixture of polycrystalline silicon and amorphous silicon and a top layer consisting of a mixture of polycrystalline silicon and silicon dioxide, and the pretreatment can be performed for about 10 minutes at 600 C in an oxygen atmosphere.

US Patent:

20140174481, Jun 26, 2014

Filed:

Feb 25, 2014

Appl. No.:

14/189014

Inventors:

- San Jose CA, US
Jeffrey Chih-Hou Lowe - Cupertino CA, US
Frank C. Ma - Scotts Valley CA, US
Sandeep Mariserla - Mountain View CA, US
Robert Anthony Sculac - Lake Oswego OR, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

H01L 21/02

US Classification:

134 26

Abstract:

The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

US Patent:

20140174656, Jun 26, 2014

Filed:

Dec 20, 2012

Appl. No.:

13/722170

Inventors:

- San Jose CA, US
Jeffrey Lowe - Cupertino CA, US

Assignee:

INTERMOLECULAR, INC. - San Jose CA

International Classification:

B05C 11/00

US Classification:

15634515

Abstract:

Methods and apparatuses for combinatorial processing are disclosed. Apparatuses include a wet etch module (WEM) operable to combinatorially etch a substrate having at least two site-isolated regions. The WEM includes a dispense manifold operable to dispense fluids and a mixing vessel unit operable to mix fluids. The WEM further includes a reactor unit operable to receive fluids from the dispense manifold or the mixing vessel unit. The reactor unit can apply a combinatorial process on a substrate having at least two site-isolated regions within the WEM. In addition, a secondary containment unit, having a leak sensor therein, is coupled to the dispense manifold, mixing vessel unit, or reactor unit to receive fluid leaks within the system. When the leak sensor detects a fluid leak, a warning may be generated. Advantageously, the generated warning does not impede substrate processing within the WEM.

US Patent:

20140177378, Jun 26, 2014

Filed:

Dec 21, 2012

Appl. No.:

13/724786

Inventors:

- San Jose CA, US
Jeffrey Chih-Hou Lowe - Cupertino CA, US
Wen Guang David Yu - Zhubei City, TW

Assignee:

INTERMOLECULAR, INC. - San Jose CA

International Classification:

B01F 15/04

US Classification:

366132, 366348, 366192

Abstract:

A system and method for providing a plurality of diluted solutions are disclosed. Successive dilution operations are performed upon mixing vessels substantially simultaneously. Measured source volumes of a source solution are placed into the mixing vessels. First measured volumes of a liquid are added to the mixing vessels. Measured first waste volumes are dispensed from the mixing vessels. Second measured volumes of the liquid are added to the mixing vessels. Measured second waste volumes are dispensed from the mixing vessels. Third measured volumes of the liquid are added to the mixing vessels. Each vessel has an individual target dilution ratio. Measured volumes and number of dilution operations are individual to each of the mixing vessels.