Jeffrey S Perkins

US Patent:

6452116, Sep 17, 2002

Filed:

Feb 28, 2001

Appl. No.:

09/796389

Inventors:

Gregg J. Armezzani - Endwell NY
Kishor V. Desai - Fremont CA
Jeffrey S. Perkins - Hauppauge NY
John J. Pessarchick - Binghamton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

174262, 174255, 361767

Abstract:

A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.

US Patent:

58843973, Mar 23, 1999

Filed:

Aug 6, 1996

Appl. No.:

8/692734

Inventors:

Gregg Joseph Armezzani - Endwell NY
Kishor Vithaldas Desai - Vestal NY
Jeffrey Scott Perkins - Endwell NY
John James Pessarchick - Binghampton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334

US Classification:

29840

Abstract:

A method for fabricating a chip carrier and attaching the chip carrier to a printed circuit board is disclosed. A plated through hole (PTH) is formed through a chip carrier substrate. The PTH has surface lands on opposite surfaces of the substrate. Next, at least one of the surfaces of the substrate is covered with a dielectric material. The dielectric material at least partially fills the PTH. A solder ball is attached to the surface land on the opposite side as the dielectric material. Then, a printed circuit board is positioned relative to the chip carrier such that the solder ball contacts a surface land of the printed circuit board. Then, the solder is reflowed. Because the solder is reflowed while the dielectric material at least partially fills the PTH, the dielectric material within the PTH prevents the solder from flowing entirely through the PTH. This prevents contamination of the opposite surface of the chip carrier.

US Patent:

57592691, Jun 2, 1998

Filed:

Jun 6, 1995

Appl. No.:

8/470507

Inventors:

Lawrence R. Cutting - Owego NY
Michael A. Gaynes - Vestal NY
Eric A. Johnson - Greene NY
Cynthia S. Milkovich - Vestal NY
Jeffrey S. Perkins - Endwell NY
Mark V. Pierson - Binghamton NY
Steven E. Poetzinger - Apex NC
Jerzy Zalesinski - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05C 1300

US Classification:

118213

Abstract:

A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.

US Patent:

59699450, Oct 19, 1999

Filed:

Feb 27, 1997

Appl. No.:

8/808829

Inventors:

Lawrence R. Cutting - Owego NY
Michael A. Gaynes - Vestal NY
Eric A. Johnson - Greene NY
Cynthia S. Milkovich - Vestal NY
Jeffrey S. Perkins - Endwell NY
Mark V. Pierson - Binghamton NY
Steven E. Poetzinger - Endicott NY
Jerzy Zalesinski - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361704

Abstract:

A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.

US Patent:

56385978, Jun 17, 1997

Filed:

Jun 7, 1995

Appl. No.:

8/476759

Inventors:

Lawrence R. Cutting - Owego NY
Michael A. Gaynes - Vestal NY
Eric A. Johnson - Greene NY
Cynthia S. Milkovich - Vestal NY
Jeffrey S. Perkins - Endwell NY
Mark V. Pierson - Binghamton NY
Steven E. Poetzinger - Endicott NY
Jerzy Zalesinski - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 336

US Classification:

29830

Abstract:

A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.

US Patent:

58318283, Nov 3, 1998

Filed:

Jun 3, 1993

Appl. No.:

8/071630

Inventors:

Lawrence R. Cutting - Qwego NY
Michael A. Gaynes - Vestal NY
Eric A. Johnson - Greene NY
Cynthia S. Milkovich - Vestal NY
Jeffrey S. Perkins - Endwell NY
Mark V. Pierson - Binghamton NY
Steven E. Poetzinger - Endicott NY
Jerzy Zalesinski - Essex Junction VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720
H05K 100

US Classification:

361704

Abstract:

A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board.