Jeffrey S Pollard

US Patent:

6540337, Apr 1, 2003

Filed:

Jul 26, 2002

Appl. No.:

10/205959

Inventors:

Jeffrey R. Pollard - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 205

US Classification:

347 65, 347 92

Abstract:

Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots.

US Patent:

6672712, Jan 6, 2004

Filed:

Oct 31, 2002

Appl. No.:

10/284867

Inventors:

Jeremy Donaldson - Corvallis OR
Eric L. Nikkel - Philomath OR
Jeffrey S. Obert - Corvallis OR
Jeffrey R. Pollard - Corvallis OR
Jeff Hess - Corvallis OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 205

US Classification:

347 65, 347 92

Abstract:

Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.

US Patent:

6833527, Dec 21, 2004

Filed:

Feb 4, 2003

Appl. No.:

10/357910

Inventors:

Jeffrey R. Pollard - Corvallis OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 205

US Classification:

21912169, 216 2, 298901

Abstract:

Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots.

US Patent:

6969822, Nov 29, 2005

Filed:

May 13, 2003

Appl. No.:

10/437377

Inventors:

Jeffrey R. Pollard - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B23K026/14

US Classification:

21912184, 21912186

Abstract:

The described embodiments relate to laser micromachining a substrate. One exemplary embodiment includes a chamber configured to receive an assist gas from an assist gas source. The chamber is configured to allow a laser beam to pass through the chamber to contact a substrate positioned outside of the chamber. The laser machine also includes a nozzle plate positioned in gas receiving relation with the chamber, the nozzle plate having at least one nozzle opening formed therein, wherein the at least one nozzle opening is substantially coincident a footprint of a feature desired to be formed in the substrate.

US Patent:

6979797, Dec 27, 2005

Filed:

Jan 31, 2002

Appl. No.:

10/061828

Inventors:

Rio T. Rivas - Corvallis OR, US
Shen Buswell - Monmouth OR, US
Mehrgan Khavari - Corvallis OR, US
Jeffrey R. Pollard - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B23K026/36

US Classification:

21912169

Abstract:

Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.

US Patent:

7040735, May 9, 2006

Filed:

Jun 20, 2003

Appl. No.:

10/601157

Inventors:

Jeremy Donaldson - Corvallis OR, US
Eric L. Nikkel - Philomath OR, US
Jeffrey S. Obert - Corvallis OR, US
Jeffrey R. Pollard - Corvallis OR, US
Jeff Hess - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/135
B41J 2/05

US Classification:

347 44, 347 65

Abstract:

Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.

US Patent:

7198726, Apr 3, 2007

Filed:

Aug 19, 2003

Appl. No.:

10/643290

Inventors:

Jeremy Donaldson - Corvallis OR, US
Eric L. Nikkel - Philomath OR, US
Jeffrey S. Obert - Corvallis OR, US
Jeffrey R. Pollard - Corvallis OR, US
Jeff Hess - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/16

US Classification:

216 27, 216 41, 216 56, 216 67

Abstract:

Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.

US Patent:

7288464, Oct 30, 2007

Filed:

Apr 11, 2005

Appl. No.:

11/104704

Inventors:

Charles C. Haluzak - Corvallis OR, US
Jeffrey R. Pollard - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 21/30

US Classification:

438455, 438456, 257774, 257E21122

Abstract:

A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates together.