A test fixture for an electronic device is provided that removes debris from a socket of the test fixture using back side air blow off. In general, the test fixture includes a circuit board, a socket on a front side of the circuit board, and an air manifold on a back side of the circuit board. Pressurized air is provided to the air manifold through an air supply inlet coupling the air manifold to an external pressurized air supply. At least one via formed through the circuit board fluidly couples the air manifold on the back side of the circuit board to the socket on the front side of the circuit board. Accordingly, the pressurized air from the air manifold flows through the vias and up through the socket such that debris is removed from the socket.
Alex Hoffman, Thomas Schnabel, Hope Knoepfle, Chris Mehlhaff, Travis Allbee, Rachel Hilgemann, Andrew Hilgemann, Kristina Robertson, Hope Boschee, Amy Johnson