Mar 2007 to 2000Carrabba's Italian Grill Dallas, TX Nov 2004 to May 2007 Corporate trainerDon Herring Mitsubishi Oak Cliff, TX Dec 2003 to Oct 2004 Internet Sales SpecialistAbuelo's Hurst, TX Jan 2001 to Dec 2003 Corporate TrainerMiranda's Cantina Burleson, TX Aug 1996 to Feb 2001 Assistant Manager
Education:
Richland High School North Richland Hills, TX 1989 General
Skills:
Knowledgeable in Megasys, Aloha, Compri, Squirrel, and adaptable to other relevant Operating Systems. Vendor/Inventory Management. Communicates effectively with customers, vendors, and staff. Guest Service Excellence. Over twenty years of experience in multiple concepts, menus, target demographics. Dedicated, with strong work ethic and ability to build lasting client relationships. Able to motivate employees to perform to their maximum potential. Responsibilities included inventory, financial reconciliation, supervising staff of multiple departments, coordinating training of new employees.
Medicine Doctors
Dr. Jeffrey A West, Forney TX - MD (Doctor of Medicine)
Dr. West graduated from the University of California, San Francisco School of Medicine in 1988. He works in Castro Valley, CA and 2 other locations and specializes in Cardiovascular Disease. Dr. West is affiliated with Alta Bates Summit Medical Center, Eden Medical Center, John Muir Medical Center Walnut Creek, San Ramon Regional Medical Center, Stanford Hospital and UCSF Medical Center
Lakeside Allergy Ear Nose & Throat 1320 Summer Lee Dr, Rockwall, TX 75032 9727715443 (phone), 9727715444 (fax)
Lakeside Allergy Ear Nose & Throat 763 E Us Hwy 80 STE 230, Forney, TX 75126 9727715443 (phone), 9727715444 (fax)
Lakeside Allergy Ear Nose & Throat 2300 W Fm 544 STE 200, Wylie, TX 75098 9727715443 (phone), 9727715444 (fax)
Education:
Medical School University of Oklahoma College of Medicine at Oklahoma City Graduated: 1994
Procedures:
Rhinoplasty Skull/Facial Bone Fractures and Dislocations Tonsillectomy or Adenoidectomy Allergen Immunotherapy Allergy Testing Hearing Evaluation Myringotomy and Tympanotomy Sinus Surgery Tracheostomy Tympanoplasty
Dr. West graduated from the University of Oklahoma College of Medicine at Oklahoma City in 1994. He works in Forney, TX and 2 other locations and specializes in Otolaryngology and Allergy. Dr. West is affiliated with Lake Pointe Medical Center.
Mori Bean & Brooks MDsMori Bean & Brooks Radiology 3625 University Blvd S, Jacksonville, FL 32216 9043995550 (phone), 9043464334 (fax)
Mori Bean & Brooks MDsMori Bean & Brooks Radiology 3599 University Blvd S STE 300, Jacksonville, FL 32216 9043995550 (phone), 9043464334 (fax)
Mori Bean & Brooks MDsMori Bean & Brooks Mds PA 2001 Kingsley Ave, Orange Park, FL 32073 9043995550 (phone), 9043464334 (fax)
Mori Bean & Brooks MDsMori Bean & Brooks PA 14550 Old Saint Augustine Rd, Jacksonville, FL 32258 9043995550 (phone), 9043464334 (fax)
Mori Bean & Brooks MDsMBB Radiology 1325 San Marco Blvd STE 301, Jacksonville, FL 32207 9042021027 (phone), 9043464349 (fax)
Mori Bean & Brooks MDsDeerwood Imaging Center 10475 Centurion Pkwy N STE 102, Jacksonville, FL 32256 9049281010 (phone)
Mori Bean & Brooks MDsMori Bean & Brooks PA Diagnostic Radiology 1250 S 18 St, Fernandina Beach, FL 32034 9043995550 (phone), 9043464334 (fax)
Education:
Medical School University of Florida College of Medicine at Gainesville Graduated: 1993
Languages:
English
Description:
Dr. West graduated from the University of Florida College of Medicine at Gainesville in 1993. He works in Fernandina Beach, FL and 6 other locations and specializes in Diagnostic Radiology. Dr. West is affiliated with Baptist Medical Center, Baptist Medical Center Nassau, Baptist Medical Center South, Baptist Medical Center-Beaches, Memorial Hospital Jacksonville and Orange Park Medical
Western Connecticut Medical GroupDanbury Hospital Pathology 24 Hospital Ave FL 2, Danbury, CT 06810 2037397453 (phone), 2037396471 (fax)
Education:
Medical School Columbia University College of Physicians and Surgeons Graduated: 1993
Languages:
English
Description:
Dr. West graduated from the Columbia University College of Physicians and Surgeons in 1993. He works in Danbury, CT and specializes in Anatomic Pathology & Clinical Pathology. Dr. West is affiliated with Danbury Hospital and New Milford Hospital.
Lakeside Allergy Ear Nose
808 S Ballard Ave, Wylie, TX 75098 Lakeside Allergy Ear Nose
1005 W Ralph Hall Pkwy, Rockwall, TX 75032 Lakeside Allergy, Ear, Nose & Throat
763 E Us Highway 80, Forney, TX 75126
Education:
University of Oklahoma(1994) Surgery
License Records
Jeffrey Allen West
License #:
0911
Category:
Psychological Associate
Issued Date:
Nov 17, 1983
Jeffrey Nelson West
License #:
6384018-B100 - Expired
Category:
Contractor
Issued Date:
Nov 13, 2006
Type:
B100 - General Building Qualifier
Isbn (Books And Publications)
The Complete Medical Guide for the Family Caregiver: The Authoritative At-Home Companion for Giving the Best Care
Robert H. Havemann - Garland TX Girish A. Dixit - San Jose CA Manoj Jain - Plano TX Eden Zielinski - Boise ID Jeffrey West - San Antonio TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21302
US Classification:
438689, 438700, 438723, 438724
Abstract:
A dual inlaid interconnect fabrication method using a temporary filler in a via during trench etch and removal of the filler after trench etch. This provides via bottom protection during trench etch.
Method For Improving Reliability Of Copper Interconnects
Jeffrey A. West - Dallas TX, US Michael D. Barth - Plano TX, US Steven P. Zuhoski - Rowlett TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21/44
US Classification:
438687, 438658
Abstract:
Doping copper interconnects () with silicon () has been shown to improve Electromigration and Via Stress Migration reliability. After copper () is deposited by electrochemical deposition and chemically-mechanically polished back, doping is achieved by flowing SiHover the copper interconnect () for 0. 5 to 5 seconds at a temperature of 325-425 C.
Integrated Circuits Having Tsvs Including Metal Gettering Dielectric Liners
An IC includes a substrate having a semiconductor top surface and a bottom surface, wherein the semiconductor top surface includes one or more active circuit components and a plurality of through silicon vias (TSVs) extending through the substrate. The plurality of TSVs include an outer dielectric liner. The dielectric liner includes at least one halogen or a Group 15 element metal gettering agent in an average concentration from 1 to 10 atomic %. A metal diffusion barrier layer is on the dielectric liner and a metal filler is on the metal barrier layer. The metal gettering agent getters metal filler that escapes the metal barrier layer.
Ic Devices Having Tsvs Including Protruding Tips Having Imc Blocking Tip Ends
A through substrate via (TSV) die includes a plurality of TSVs including an outer dielectric sleeve and an inner metal core and protruding TSV tips including sidewalls that emerge from the TSV die. A passivation layer lateral to the protruding TSV tips is on a portion of the sidewalls of the protruding TSV tips. The passivation layers is absent from a distal portion of the protruding TSV tips to provide an exposed portion of the inner metal core. The TSV tips include bulbous distal tip ends including a first metal layer including a first metal other than solder and a second metal layer including a second metal other than solder that covers the exposed tip portion. The bulbous distal tip ends cover a portion of the TSV sidewalls and are over a topmost surface of the outer dielectric sleeve, and have a maximum cross sectional area that is ≧25% more as compared to a cross sectional area of the protruding TSV tips below the bulbous distal tip ends.
Ic Having Tsv Arrays With Reduced Tsv Induced Stress
Jeffrey Alan West - Dallas TX, US Masazumi Amagai - Tsukuba, JP
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 23/48 H01L 23/52 H01L 29/40
US Classification:
257786, 257698
Abstract:
An integrated circuit (IC) includes a substrate having a top side having active circuitry thereon including a plurality of metal interconnect levels including a first metal interconnect level and a top metal interconnect level, and a bottom side. At least one TSV array includes a plurality of TSVs. The TSVs are positioned in rows including a plurality of interior rows and a pair of exterior rows and a plurality of columns including a plurality of interior columns and a pair of exterior columns. At least a portion of the TSVs in the array are electrically connected TSVs that are coupled to a TSV terminating metal interconnect level selected from the plurality of metal interconnect levels. At least one of the exterior rows or exterior columns include a lower number of electrically connected TSVs compared to a maximum number of electrically connected TSVs in the interior rows and interior columns, respectively.
Embedded Scribe Lane Crack Arrest Structure For Improved Ic Package Reliability Of Plastic Flip Chip Devices
Jeffrey A. West - Dallas TX, US Patricia Diane Vincent - Prosper TX, US Robert A. Tuerck - Garland TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 23/544
US Classification:
257620, 257621, 257623, 257E23194
Abstract:
A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.
Semiconductor Device Having Enhanced Scribe And Method For Fabrication
Jeffrey Alan West - Dallas TX, US Craig Beddingfield - McKinney TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 23/544 H01L 21/00
US Classification:
257620, 257E22011, 257E21214, 438106
Abstract:
In a semiconductor device for use in a wafer level chip scale package (WLCSP) and a method for fabrication, an inner scribe seal is formed around a functional circuit area that does not extend all the way into the corners of the rectangular die, and an outer scribe seal follows the perimeter of the die and into the corners, with the outer scribe seal having a continuous barrier wall towards the die edges so that moisture penetration in dielectric layers of the die is minimized, and cracks and delamination are stopped near the die edges. Limiting the extent of the insulating layer or layers in the WLCSP to cover the functional circuit area also reduces the stresses caused by these layers near the die corners.
Electronic Assemblies Including Mechanically Secured Protruding Bonding Conductor Joints
An electronic assembly includes an IC die including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending outward from the IC die. A workpiece has a workpiece surface including at least one electrical connector and at least one framed hollow receptacle coupled to the electrical connector. The receptacle is formed from metal and includes sidewall portions and a bent top that defines a cavity. The bent top includes bent peripheral shelf regions that point downward into the cavity and towards the sidewall portions. The protruding bonding feature is inserted within the cavity of the receptacle and contacts the bent peripheral shelf regions along a contact area to form a metallic joint, wherein the contact area is at least primarily along the sidewall surfaces.
Chicago, ILI am a proven information technology leader experienced in multiple disciplines including compliance, business and financial management, risk management... I am a proven information technology leader experienced in multiple disciplines including compliance, business and financial management, risk management, project management, and staff management. I have utilized my skills to consistently achieve the business and growth objectives of global...
Lumberg Elementary School Edgewater CO 1970-1977, Belmont Junior High School Lakewood CO 1977-1977, Everitt Middle School Wheat Ridge CO 1977-1978, Kepner Middle School Denver CO 1978-1980
Community:
Max Salazar, Mack Pruneda, Laura Russell, Peggy Kroon, Wayne Belcher