Samsung Austin Semiconductor since Jan 2011
Process Engineer
Oak Ridge National Laboratory May 2010 - Jul 2010
Intern
Purdue University Aug 2008 - May 2010
Graduate Research Assistant
Junior Engineering Company of ENSTA Bretagne Sep 2007 - Jun 2008
President
CEMEX National Technical Center Jun 2007 - Jul 2007
Engineering Technician Intern
Education:
Purdue University 2008 - 2010
Master of Science, Fluid and Structural Mechanics
ENSTA Bretagne 2006 - 2008
Bachelor of Science, Mechanical Engineering
Skills:
Cfd Finite Element Analysis Fluid Mechanics Matlab Engineering Semiconductor Manufacturing Heat Transfer Fortran Thermodynamics Numerical Analysis Semiconductors Labview Ansys Design of Experiments Aerodynamics Simulations Dynamics Python
- Milpitas CA, US William Pierson - Austin TX, US Jeremy Nabeth - Austin TX, US Sanghuck Jeon - Gyeonggi-do, KR Onur N. Demirer - Austin TX, US Miguel Garcia-Medina - Austin TX, US Soujanya Vuppala - Fremont CA, US
International Classification:
G03F 7/20 G06F 17/50
Abstract:
Methods and systems for providing overlay corrections are provided. A method may include: selecting an overlay model configured to perform overlay modeling for a wafer; obtaining a first set of modeled results from the overlay model, the first set of modeled results indicating adjustments applicable to a plurality of term coefficients of the overlay model; calculating a significance matrix indicating the significance of the plurality of term coefficients; identifying at least one less significant term coefficient among the plurality of term coefficients based on the calculated significance matrix; obtaining a second set of modeled results from the overlay model, the second set of modeled results indicating adjustments applicable to the plurality of term coefficients except for the identified at least one less significant term coefficient; and providing the second set of modeled results to facilitate overlay correction.