Jerry D Bolen

US Patent:

7034544, Apr 25, 2006

Filed:

Jun 30, 2003

Appl. No.:

10/611791

Inventors:

Xiaoning Ye - Hillsboro OR, US
Dennis Miller - Sherwood OR, US
Jerry D. Bolen - Molalla OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G01R 31/11
H05K 7/02
H03H 7/38

US Classification:

324534, 361777, 333 33

Abstract:

Methods and apparatus that minimize the impedance discontinuity between a component and a signal trace is described. The methods and apparatus generally comprise at least one signal trace disposed on a dielectric layer, wherein the signal trace comprises a first width which is wider than a second width, a via connected to the first width of the signal trace, and a component electrically attached to the via, wherein an impedance discontinuity between the signal trace and the component is lowered.

US Patent:

20040259405, Dec 23, 2004

Filed:

Jun 20, 2003

Appl. No.:

10/600668

Inventors:

John Lynch - Forest Grove OR, US
Jerry Bolen - Molalla OR, US

International Classification:

H01R013/62

US Classification:

439/326000

Abstract:

According to some embodiments, a device includes a connector to hold an electrical module at an acute angle with respect to a surface on which the connector is to be mounted, and a first contact, a first portion of the first contact to contact the surface and a second portion of the first contact to contact the electrical module, a distance between the first portion and the second portion equal to a first length. A device may also include a second contact adjacent to the first contact, a first portion of the second contact to contact the surface and a second portion of the second contact to contact the electrical module, a distance between the first portion of the second contact and the second portion of the second contact substantially equal to the first length.