Jerry D Kreger

US Patent:

52657922, Nov 30, 1993

Filed:

Aug 20, 1992

Appl. No.:

7/932754

Inventors:

Shane Harrah - Menlo Park CA
Trevor J. Smith - Nevada City CA
John Uebbing - Palo Alto CA
Thomas Fajardo - Santa Clara CA
Jerry D. Kreger - Cupertino CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01L 2150

US Classification:

228 62

Abstract:

A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.

US Patent:

54752418, Dec 12, 1995

Filed:

Oct 27, 1993

Appl. No.:

8/119913

Inventors:

Shane Harrah - Menlo Park CA
Trevor J. Smith - Nevada City CA
John Uebbing - Palo Alto CA
Thomas Fajardo - Santa Clara CA
Jerry D. Kreger - Cupertino CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01L 3300

US Classification:

257 99

Abstract:

A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive. LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.