Jesus Ardinez Osuna

US Patent:

59686065, Oct 19, 1999

Filed:

Jun 30, 1997

Appl. No.:

8/884995

Inventors:

Jesus E. Osuna - National City CA
Keith M. Mason - Ocean City MD
Vernon E. Stygar - San Diego CA

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

C08J 718
C08K 300
C08K 338
H01L 2336

US Classification:

427510

Abstract:

The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0. 5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

US Patent:

59631210, Oct 5, 1999

Filed:

Nov 11, 1998

Appl. No.:

9/190032

Inventors:

Vernon E. Stygar - San Diego CA
Jesus E. Osuna - National City CA
Brian T. Pointer - Brightlingsea, GB
John J. Ekis - Fallbrook CA

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

H01H 7120
H01B 106
H01B 120
H01B 122

US Classification:

337155

Abstract:

The present invention relates to compositions for use in forming resettable electronic circuit protection devices or fuses, methods of forming resettable fuses using the compositions, and resettable fuses formed from the compositions. Resettable fuse compositions according to the present invention include a mixture of the reaction product of polyethylene glycol and a diepoxide having a molecular weight of at least 18,000, solvent, conductive particles, and optional solvent volatility adjusters. In a preferred embodiment, resettable fuses according to the present invention are formed by screen printing the compositions directly onto printed electric circuits to form fuses. During current overload conditions, the temperature of the resettable fuse material rapidly increases due to resistive heating generated by excessive current flow through the conductive particle chains or pathways. In such current overload conditions, resettable fuses according to the present invention rapidly convert from a low resistance solid state to a high resistance liquidus state wherein the chains of conductive particles become highly separated thus causing the flow of electric current through the fuse to become completely cut off. After the overload condition has been cleared, resettable fuses according to the present invention self cool, re-solidify, and return to their prior low resistance solid state without exhibiting any change in resistance or switching temperature due to changes in the degree of crystallinity of the heat cured reaction product.

US Patent:

6204303, Mar 20, 2001

Filed:

Sep 28, 1999

Appl. No.:

9/408568

Inventors:

Jesus E. Osuna - San Diego CA
Keith M. Mason - Ocean City MD
Vernon E. Stygar - San Diego CA

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

C08F 248
C08L 6310
C08K 304
C08K 338

US Classification:

522 71

Abstract:

The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0. 5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

US Patent:

60204249, Feb 1, 2000

Filed:

Jun 30, 1997

Appl. No.:

8/884829

Inventors:

Jesus E. Osuna - National City CA
Keith M. Mason - Ocean City MD
Vernon E. Stygar - San Diego CA

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

C08K 300

US Classification:

524847

Abstract:

The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0. 005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.

US Patent:

62105205, Apr 3, 2001

Filed:

Sep 22, 1999

Appl. No.:

9/399546

Inventors:

Jesus E. Osuna - National City CA
Keith M. Mason - Ocean City MD
Vernon E. Stygar - San Diego CA

Assignee:

Ferro Corporation - Cleveland OH

International Classification:

C09J 900
B05D 302
H01L 2336

US Classification:

1563063

Abstract:

The present invention provides a novel screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0. 005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.