Ji W Yang

US Patent:

7289326, Oct 30, 2007

Filed:

Feb 2, 2006

Appl. No.:

11/345957

Inventors:

Ali Heydari - Albany CA, US
Ji L. Yang - Mountain View CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

H05K 7/20
H05K 5/00
H01L 23/12
H01L 23/34

US Classification:

361699, 361714, 361719, 361733, 257704, 257713, 257714

Abstract:

A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.

US Patent:

20070177351, Aug 2, 2007

Filed:

Feb 2, 2006

Appl. No.:

11/345722

Inventors:

Ali Monfarad - Albany CA, US
Ji Yang - Mountain View CA, US

International Classification:

H05K 7/20

US Classification:

361699000

Abstract:

An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.

US Patent:

47989726, Jan 17, 1989

Filed:

Mar 3, 1987

Appl. No.:

7/021251

Inventors:

Ronald J. Melanson - Sunnyvale CA
Ji L. Yang - Palo Alto CA

Assignee:

Digital Equipment Corporation - Mayanard MA

International Classification:

H03K 1710
H03K 17687
H03K 19003
H03K 1704

US Classification:

307270

Abstract:

A semiconductor buffer circuit and buffering method for driving capacitive loads that enhances the current sinking and sourcing drive characteristics at times when the input signal is changing. Two transistors are used, a source follower and a current source pull-down, with an input signal applied to the control input of the source follower transistor. The complement of the input signal is capacitively coupled to the control input of the current source pull-down transistor. As a result, changes in the input voltage increase or decrease the conductivity of the current source pull-down transistor, thereby allowing the capacitive load to be charged and discharged more efficiently.

US Patent:

20220360665, Nov 10, 2022

Filed:

Jul 20, 2022

Appl. No.:

17/869151

Inventors:

- Mountain View CA, US
Jun Yin - Palo Alto CA, US
Ji Yang - Redwood City CA, US

Assignee:

Google LLC - Mountain View CA

International Classification:

H04M 3/42
H04M 3/22
H04W 4/16

Abstract:

Implementations described herein relate to methods, systems, and computer-readable media to label incoming phone calls. A method to label an incoming phone call includes detecting the incoming phone call associated with a caller identifier (ID), determining a location associated with the call, and analyzing a call header of the call to determine one or more call characteristics. The method further includes determining, based on the location and the call characteristics, if the location is spoofed and determining, based on the caller ID and the call characteristics, if an access network associated with the call is spoofed. The method further includes applying a trained machine learning model to determine whether the call is a robocall. The method further includes assigning a label to the call that indicates whether the call is a spoofed call or is the robocall and sending the label to a callee device associated with the call.

US Patent:

20160345145, Nov 24, 2016

Filed:

May 20, 2016

Appl. No.:

15/160450

Inventors:

- Mountain View CA, US
Shishir Kumar Agrawal - Sunnyvale CA, US
Ji Yang - Mountain View CA, US
Cheuksan Edward Wang - Campbell CA, US
Abhijith Shastry - San Jose CA, US

International Classification:

H04W 4/14
H04W 4/12
H04W 4/18

Abstract:

In one implementation, a computer-implemented method includes: receiving, at a computer system, a multimedia message service (MMS) message for delivery to a client computing device; storing, by the computer system, the MMS message; generating, by the computer system, a traditional short message service (SMS) message including a notification that the MMS message is available for download from the computer system; transmitting, by the computer system, the SMS message to the client computing device; receiving, after transmitting the SMS message, a request from the client computing device to download the MMS message; and sending, by the computer system, the MMS message to the client computing device.