Eric C Anderson - Irving TX, US Ronald J Biediger - Houston TX, US Jie Chen - Houston TX, US Brian Dupre - Houston TX, US Pedro Lory - Antwerp, BE Robert V. Market - Pearland TX, US Keith A. Monk - League City TX, US Michael M. Savage - Pearland TX, US Reginald Tennyson - Missouri City TX, US Brandon M. Young - Germantown TN, US
Assignee:
Pfizer Inc. - New York NY
International Classification:
C07D 333/56
US Classification:
549 57
Abstract:
Provided are compounds that are modulators of CCR9 receptor activity, compositions containing the compounds and methods of use of the compounds and compositions. In certain embodiments, provided are methods for treating or ameliorating diseases associated with modulation of CCR9 receptor activity.
Modulators Of C3A Receptor And Methods Of Use Thereof
Ronald J. Biediger - Houston TX, US Huong M. Bui - Pearland TX, US Jie Chen - Houston TX, US Kevin M. Henry - Pearland TX, US Thomas Thrash - Houston TX, US
Provided are compounds that are modulators of C3a receptor activity, compositions containing the compounds and methods of use of the compounds and compositions. In certain embodiments, the compounds are pyridones. In certain embodiments, provided are methods for treatment or amelioration of diseases associated with modulation of C3a receptor activity.
Semiconductor Package With Shunt And Patterned Metal Trace
- Dallas TX, US Rajen Manicon Murugan - Dallas TX, US Liang Wan - Chengdu, CN Makarand Ramkrishna Kulkarni - Dallas TX, US Jie Chen - Plano TX, US Steven Alfred Kummerl - Carrollton TX, US
International Classification:
H01L 23/538 H01L 23/00 H01L 21/48
Abstract:
A semiconductor package includes a first layer including a semiconductor die and a shunt embedded within a first dielectric substrate layer, and metal pillars extending therethrough. The semiconductor package further includes a second layer stacked on the first layer, the second layer including a metal trace patterned on the first dielectric substrate layer, and a second dielectric substrate layer over the metal trace. The metal trace electrically connects a first portion of the shunt to a first metal pillar of the metal pillars and electrically connects a second portion of the shunt to a second metal pillar of the metal pillars. The semiconductor package further includes a base layer opposite the second layer relative the first layer, the base layer forming exposed electrical contact pads for the semiconductor package, the electrical contact pads providing electrical connections to the shunt, the metal pillars, and the semiconductor die.
In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.
Semiconductor Device With A Multilayer Package Substrate
A semiconductor device includes a die having an input port and an output port. The semiconductor device also includes a multilayer package substrate with pads on a surface of the multilayer package substrate configured to be coupled to circuit components of a printed circuit board. The multilayer package substrate also includes a passive filter comprising an input port and an output port, and a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to the input port of the die with a second via of the multilayer package substrate. The planar inductor extends parallel to the surface of the multilayer package substrate.
Hall-Effect Sensor Package With Added Current Path
- Dallas TX, US Yiqi Tang - Allen TX, US Jie Chen - Dallas TX, US Enis Tuncer - Dallas TX, US Usman Mahmood Chaudhry - McKinney TX, US Tony Ray Larson - Tucson AZ, US Rajen Manicon Murugan - Dallas TX, US John Paul Tellkamp - Rockwall TX, US Satyendra Singh Chauhan - Murphy TX, US
A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including ≥1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to ≥1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.
Joint position by Purdue University and Total West Lafayette, IN Oct 2013 to Oct 2015 Industrial Postdoc Research AssociateSchlumberger-Doll Research Cambridge, MA Jun 2013 to Oct 2013 InternshipUniversity of Washington Seattle, WA Oct 2010 to Jun 2013 Research AssistantUniversity of Washington Houston, TX Jun 2012 to Sep 2012 InternshipGeorgia Southern University Statesboro, GA 2008 to 2009 Research Assistant
Education:
University of Washington Seattle, WA 2009 to 2013 Ph.D in Department of MathematicsGeorgia Southern University May 2009 M.Sc. in Mathematical ScienceZhejiang University Hangzhou, CN 2003 to 2007 B.S. in Applied Math
Tibco Software Inc Palo Alto, CA Nov 2012 to Jun 2013 GL Accountant (Contractor)Occidental Petroleum Corporation Houston, TX Jun 2010 to Sep 2012 Financial Reporting AccountantCOSL Drilling Pan-Pacific Ltd (parent company of Premium Driling Inc.) Singapore Jun 2009 to Dec 2009 Internal ConsultantPremium Drilling Inc. (the company was dissolved in June 2009) Houston, TX Sep 2006 to Jun 2009 Senior AccountantNoble Corporation Sugar Land, TX Jun 2004 to Sep 2006 Staff AccountantFoxconn Corporation Houston, TX Apr 2003 to Jun 2004 Accounts Payable Specialist
Education:
University of Houston Houston, TX Dec 2002 Bachelor of Business Administration in Accounting
Skills:
Proficient in Oracle R12 & 11i, Hyperion Financial Management, Hyperion Enterprise, Blackline Systems, experienced with SAP, JD Edwards, proficient in Excel, Access, Word, Outlook
WesternGeco, Schlumberger Houston, TX Jun 2012 to Sep 2012 InternshipUniversity of Washington Seattle, WA 2011 to 2012 Research AssistantGeorgia Southern University Statesboro, GA 2008 to 2009 Research Assistant
Education:
Georgia Southern University May 2009 M.Sc. in Department of Mathematical ScienceUniversity of Washington Ph.D in Department of Mathematics
Geo-Mathematical Imaging Group, Dept. of Math, Purdue University
Oct 2013 to 2000 Industrial Postdoc Research Associate funded by TotalSchlumberger-Doll Research Cambridge, MA Jun 2013 to Oct 2013 InternshipUniversity of Washington Seattle, WA Oct 2010 to Jun 2013 Research AssistantWesternGeco, Schlumberger Houston, TX Jun 2012 to Sep 2012 InternshipGeorgia Southern University Statesboro, GA 2008 to 2009 Research Assistant
Education:
University of Washington Seattle, WA 2009 to 2013 Ph.D in Department of MathematicsGeorgia Southern University May 2009 M.Sc. in Department of Mathematical ScienceZhejiang University Hangzhou, China 2003 to 2007 BS in Applied math
University Of Virginia Transplant Center 1300 Jefferson Park Ave FL 4, Charlottesville, VA 22903 4349248604 (phone), 4349240017 (fax)
UVA Medical Center Inpatient Transplant Surgery & Urology 1215 Lee St 5 W, Charlottesville, VA 22908 4349242338 (phone), 4349242355 (fax)
Languages:
English
Description:
Ms. Chen works in Charlottesville, VA and 1 other location and specializes in Transplant Surgery. Ms. Chen is affiliated with University Of Virginia Medical Center.
atusik, a professor of electrical engineering and computer science at MIT who leads the Computational Design and Fabrication Group within the Computer Science and Artificial Intelligence Laboratory (CSAIL); Meng Jiang, associate professor at the University of Notre Dame; and senior author Jie Chen,