Jie Yang

US Patent:

6465045, Oct 15, 2002

Filed:

Oct 18, 2000

Appl. No.:

09/691706

Inventors:

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Cleveland OH

Assignee:

Case Western Reserve University - Cleveland OH

International Classification:

C23C 1608

US Classification:

427255393, 427 58, 42725528

Abstract:

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

US Patent:

6479166, Nov 12, 2002

Filed:

May 1, 2000

Appl. No.:

09/561675

Inventors:

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Woodbury CT
Stephen M. Phillips - Chesterland OH

Assignee:

Case Western Reserve University - Cleveland OH

International Classification:

H01L 2912

US Classification:

428620, 428636, 428446

Abstract:

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

US Patent:

6610361, Aug 26, 2003

Filed:

Nov 26, 1999

Appl. No.:

09/449790

Inventors:

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Woodbury CT
Stephen M. Phillips - Chesterland OH

Assignee:

Case Western Reserve University - Cleveland OH

International Classification:

C23C 1624

US Classification:

42725518, 42725515, 4272557, 427402

Abstract:

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

US Patent:

62680684, Jul 31, 2001

Filed:

Mar 1, 1999

Appl. No.:

9/260168

Inventors:

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Cleveland OH

Assignee:

Case Western Reserve University - Cleveland OH

International Classification:

B32B 1501

US Classification:

428620

Abstract:

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.